Mr. Marek Danczak
at Technische Univ Dresden
SPIE Involvement:
Author
Publications (1)

PROCEEDINGS ARTICLE | July 21, 2004
Proc. SPIE. 5392, Testing, Reliability, and Application of Micro- and Nano-Material Systems II
KEYWORDS: Packaging, X-ray computed tomography, Visualization, Signal attenuation, X-rays, Nondestructive evaluation, Tomography, Microelectronics, Computed tomography, Reconstruction algorithms

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