Mark Kelling
at Global 450 Consortium (G450C)
SPIE Involvement:
Author
Publications (9)

PROCEEDINGS ARTICLE | March 23, 2016
Proc. SPIE. 9782, Advanced Etch Technology for Nanopatterning V
KEYWORDS: Lithography, Optical lithography, Polymethylmethacrylate, Etching, Data processing, Directed self assembly, Line edge roughness, Photoresist processing, Semiconducting wafers, Tin

PROCEEDINGS ARTICLE | April 4, 2012
Proc. SPIE. 8324, Metrology, Inspection, and Process Control for Microlithography XXVI
KEYWORDS: Metrology, Data modeling, Metals, Scatterometry, Extreme ultraviolet, Critical dimension metrology, Line edge roughness, Semiconducting wafers, Scatter measurement

PROCEEDINGS ARTICLE | March 23, 2012
Proc. SPIE. 8322, Extreme Ultraviolet (EUV) Lithography III
KEYWORDS: Lithography, Optical lithography, Lithographic illumination, Metals, Printing, Photomasks, Extreme ultraviolet, Extreme ultraviolet lithography, Double patterning technology, Line edge roughness

PROCEEDINGS ARTICLE | March 20, 2012
Proc. SPIE. 8325, Advances in Resist Materials and Processing Technology XXIX
KEYWORDS: Roads, Etching, Polymers, Image processing, Scanning electron microscopy, Optical proximity correction, Reactive ion etching, Neodymium, Semiconducting wafers, Photoresist developing

PROCEEDINGS ARTICLE | March 13, 2012
Proc. SPIE. 8326, Optical Microlithography XXV
KEYWORDS: Lithography, Deep ultraviolet, Etching, Photomasks, Immersion lithography, Reactive ion etching, Semiconducting wafers, 193nm lithography, Chemical mechanical planarization, Back end of line

SPIE Journal Paper | October 1, 2011
JM3 Vol. 10 Issue 04
KEYWORDS: Metrology, Scatterometry, Critical dimension metrology, Semiconducting wafers, Data modeling, Atomic force microscopy, Transmission electron microscopy, Inspection, 3D metrology

Showing 5 of 9 publications
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