Mr. Masahiko Harumoto
at SCREEN Semiconductor Solutions Co Ltd
SPIE Involvement:
Author
Publications (26)

PROCEEDINGS ARTICLE | March 28, 2018
Proc. SPIE. 10586, Advances in Patterning Materials and Processes XXXV
KEYWORDS: Carbon, Etching, Silicon, Coating, Resistance, Photomasks, Reactive ion etching, Thin film coatings, Semiconducting wafers, System on a chip

PROCEEDINGS ARTICLE | March 19, 2018
Proc. SPIE. 10586, Advances in Patterning Materials and Processes XXXV
KEYWORDS: Semiconductors, Lithography, Logic, Optical lithography, Contamination, Metals, Silicon, 3D modeling, Directed self assembly, Reactive ion etching

PROCEEDINGS ARTICLE | March 13, 2018
Proc. SPIE. 10586, Advances in Patterning Materials and Processes XXXV
KEYWORDS: Lithography, Reticles, Optical lithography, Etching, Ultraviolet radiation, Annealing, Photoresist materials, Line width roughness, Line edge roughness, Semiconducting wafers

PROCEEDINGS ARTICLE | March 27, 2017
Proc. SPIE. 10143, Extreme Ultraviolet (EUV) Lithography VIII
KEYWORDS: Lithography, Metrology, Annealing, Extreme ultraviolet, Line width roughness, Extreme ultraviolet lithography, Thin film coatings, Semiconducting wafers, Wafer testing, Standards development

PROCEEDINGS ARTICLE | March 27, 2017
Proc. SPIE. 10146, Advances in Patterning Materials and Processes XXXIV
KEYWORDS: Optical lithography, Polymers, Glasses, Ultraviolet radiation, Annealing, Silicon, Scanning electron microscopy, Line width roughness, Directed self assembly, Semiconducting wafers

PROCEEDINGS ARTICLE | March 27, 2017
Proc. SPIE. 10146, Advances in Patterning Materials and Processes XXXIV
KEYWORDS: Optical lithography, Polymers, Annealing, Oxygen, Scanning electron microscopy, Line width roughness, Directed self assembly, Thin film coatings, Semiconducting wafers, Atmospheric modeling

Showing 5 of 26 publications
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