When the design engineers discuss the new concept of the embedded electronic packaging, there are a lot of kinds of
materials on the list, the resins, silicones, and so on. Therefore, it is very important to study and understand the basic
effect of the new materials on the important components of their products at the early stage. In the study, the authors
used simulation approach to investigate several different concepts of the embed package, and the focus is the effect of
the important components. Based upon the analytical results, the advantage and demerit of each concept were discussed.