We have evaluated a unified mask pattern data format named "OASIS.MASK"1 and a unified job deck format
named "MALY"<sup>2</sup> for mask tools as the input data formats of the inspection tool using the mask data and the photomask
produced with the 65nm design rule. The data conversion time and the data volume for the inspection data files were
evaluated by comparing with the results for using the native EB data and the native job deck data. The inspection speed
and the defect number of the inspection tool were also evaluated with the actual inspection tool. We have confirmed that
there is no large issue in applying OASIS.MASK and MALY to the input data formats of the inspection tool and they
can become the common intermediate format in our MDP flow. The detail of evaluation results will be mainly
introduced in this paper.
Recently, mask design has been becoming more complex with the increase of data volume. Therefore, it requires more
functionality and portability in the mask specification and layout definition for the efficient data handling together with
industry standard. SEMI-P10 order format has universal layout definition for the all sorts of mask specifications. We
expect OASIS<sup>TM</sup> (Open Artwork System Interchange Standard; SEMI standard P39) instead of conventional GDS-II to
come into wide use as a more compressive stream format for 45nm node and beyond. The OASIS format is suitable for
the enormous pattern file size and sub-nanometer design grid.
Although SEMI-P10 is convenient to achieve all of our requirements, its complete definition is very complicated and is
difficult to set up full parameters in the primary stage of mask design for production chips. In this work, we focused on
minimum syntax of the chip location information from portion of SEMI-P10. And we define P10-JOBDECK as a subset
of whole SEMI-P10 regulations. So, by use of P10-JOBDECK and OASIS data format, we have built up the new data
handling infrastructure such as data file transfer and pattern layout viewing for the high-end mask manufacturing.
In this system, the coordinates of P10-JOBDECK are described in 4X image with mirror inversion and tone reversal
parameters. We use 1X coordinates in P10-JOBDECK for the pattern data files because they are the dimensions familiar
to the designer, and the transformation for the mask shop is handled automatically. This style is effective for shortening
the data conversion time and preventing mishandling of data. We also developed the additional viewer functions of
HOTSCOPE® to confirm the pattern layout on the digital display.
It is possible to add mask DFM information (design information for mask manufacturability) by the extension to the full
SEMI-P10 syntax and by the use of built-in OASIS properties in the future.
In this paper, we will discuss the practical application of P10-JOBDECK and the performance results of HOTSCOPE.
In recent years, Quick-TAT (Turn-Around Time) in preparing masks is very important factor together with the complexity and cost in mask development and manufacturing in higher-end devices. Especially in the development phase of customer-driven devices such as SOC, MCU and so on, QTAT role of mask supply might get a larger weight in LSI business. However, overhead in workflow, system and burden of mask users (designer, etc) in mask making are significant, not to mention the increase of OPC processing time and DA cost. For responding to the efficient and precipitous manufacturing requirement even for complicated leading-edge devices, we should focus on the optimization of workflow system minimization of mask-work resources in users (designer, etc.). Therefore, new Renesas Integrated Mask Operation System (RIMOS) has been developed as making masks “Everywhen you want” supporting five key functions as follows: (1) Simple interface to input mask-making parameters on Web-based integrated system (2) Hierarchical specification system of high maintainability and capability for SEMI-P10 format (3) Easy operation to instruct build-in specification for manufacturing such as complicated CD inspection (4) Bi-directional synchronization between mask-shop and wafer-fabs MES supporting the flexible multi-pass supply of masks (5) On-line quality reporting for mask-SPC monitoring supporting. This paper shows architecture of the new system 'RIMOS' and the estimate of TAT reduction in workflow.