TeraXion started silicon photonics activities aiming at developing building blocks for new products and customized
solutions. Passive and active devices have been developed including MMI couplers, power splitters, Bragg grating
filters, high responsivity photodetectors, high speed modulators and variable optical attenuators. Packaging solutions
including fiber attachment and hybrid integration using flip-chip were also developed. More specifically, a compact
packaged integrated coherent receiver has been realized. Good performances were obtained as demonstrated by our
system tests results showing transmission up to 4800 km with BER below hard FEC threshold. The package size is small
but still limited by the electrical interface. Migrating to more compact RF interface would allow realizing the full benefit
of this technology.