Matthew L. Moynihan
Program Manager at Rohm and Haas Electronic Materials, LLC
SPIE Involvement:
Publications (9)

Proceedings Article | 12 February 2009 Paper
Ed Anzures, Roger Dangel, Rene Beyeler, Allie Cannon, Folkert Horst, Cecilia Kiarie, Phil Knudsen, Norbert Meier, Matt Moynihan, Bert Jan Offrein
Proceedings Volume 7221, 72210I (2009)
KEYWORDS: Waveguides, Silicon, Polymers, Coating, Reliability, Optical interconnects, Wave propagation, Nitrogen, Optics manufacturing, Photomasks

Proceedings Article | 11 March 2005 Paper
Matthew Moynihan, Bruno Sicard, Tuan Ho, Luke Little, Nick Pugliano, James Shelnut, Hai Bin Zheng, Phil Knudsen, Dan Lundy, Nancy Chiarotto, Curtis Lustig, Craig Allen
Proceedings Volume 5731, (2005)
KEYWORDS: Waveguides, Silicon, Optical interconnects, Copper, Signal attenuation, Polymers, Optics manufacturing, Reliability, Epoxies, Lithography

Proceedings Article | 10 June 2004 Paper
Nick Pugliano, Nancy Chiarroto, John Fisher, Noel Heiks, Tuan Ho, Garo Khanarian, Matthew Moynihan, Nathan Pawlowski, Jim Shelnut, David Sherrer, Bruno Sicard, Hai-Bin Zheng
Proceedings Volume 5358, (2004)
KEYWORDS: Waveguides, Optics manufacturing, Polymers, Integrated optics, Manufacturing, Plating, Connectors, Silicon, Metals, Data integration

Proceedings Article | 10 November 2003 Paper
Garo Khanarian, Yujian You, R. Gore, M. Talley, S. Ibbitson, A. Lamola, M. Gallagher, Bruno Sicard, Matthew Moynihan, James Shelnut
Proceedings Volume 5212, (2003)
KEYWORDS: Waveguides, Refractive index, Scattering, Cladding, Rayleigh scattering, Light scattering, Particles, Interfaces, Silicon, Semiconducting wafers

Proceedings Article | 10 November 2003 Paper
Matthew Moynihan, Craig Allen, Tuan Ho, Luke Little, Nathan Pawlowski, Nick Pugliano, James Shelnut, Bruno Sicard, Hai Bin Zheng, Garo Khanarian
Proceedings Volume 5212, (2003)
KEYWORDS: Waveguides, Silicon, Optical interconnects, Lithography, Planar waveguides, Refractive index, Polymers, Scattering, Thermography, Birefringence

Showing 5 of 9 publications
Conference Committee Involvement (1)
Photonics Packaging and Integration VII
27 January 2005 | San Jose, California, United States
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