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Matthias Petzold
at Fraunhofer-IWM
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Publications (4)
SPIE Journal Paper | 20 February 2014 Open Access
Scanning acoustic gigahertz microscopy for metrology applications in three-dimensional integration technologies
Sebastian Brand, Adriana Lapadatu, Tatjana Djuric, Peter Czurratis, Jan Schischka, Matthias Petzold
JM3, Vol. 13, Issue 01, 011207, (February 2014) https://doi.org/10.1117/12.10.1117/1.JMM.13.1.011207
KEYWORDS: Acoustics, Inspection, Microscopy, Semiconducting wafers, Interfaces, Metrology, Photomicroscopy, Silicon, 3D metrology, Microscopes
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Proceedings Article | 19 April 2002 Paper
Strength and long-term reliability testing of wafer-bonded MEMS
Matthias Petzold, Dieter Katzer, M. Wiemer, Joerg Bagdahn
Proceedings Volume 4755, (2002) https://doi.org/10.1117/12.462863
KEYWORDS: Semiconducting wafers, Interfaces, Wafer testing, Wafer bonding, Silicon, Reliability, Oxides, Microelectromechanical systems, Mechanics, Control systems
Proceedings Article | 2 October 2001 Paper
Strength assessment of wafer-bonded micromechanical components using the micro-chevron test
Proceedings Volume 4558, (2001) https://doi.org/10.1117/12.442994
KEYWORDS: Semiconducting wafers, Reactive ion etching, Oxides, Silicon, Wafer bonding, Microelectromechanical systems, Mechanics, Reliability, Glasses, Electrodes
Proceedings Article | 2 October 2001 Paper
Fracture toughness and fatigue investigations of polycrystalline silicon
Joerg Bagdahn, Jan Schischka, Matthias Petzold, William Sharpe
Proceedings Volume 4558, (2001) https://doi.org/10.1117/12.442998
KEYWORDS: Silicon, Ion beams, Actuators, Oxides, Mechanics, Etching, Scanning electron microscopy, Sensors, Reliability, Gallium
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