Matthias Rudolph
at Fraunhofer IPMS-CNT
SPIE Involvement:
Author
Publications (6)

PROCEEDINGS ARTICLE | March 21, 2016
Proc. SPIE. 9779, Advances in Patterning Materials and Processes XXXIII
KEYWORDS: Microfluidics, Polymers, Water, Particles, Silicon, Chemistry, Scanning electron microscopy, Photoresist materials, Plasma etching, Photoresist processing, Semiconducting wafers, Fluid dynamics, Mask cleaning, Plasma, Advanced cleaning techniques

PROCEEDINGS ARTICLE | March 8, 2016
Proc. SPIE. 9778, Metrology, Inspection, and Process Control for Microlithography XXX
KEYWORDS: Semiconductors, Electron beam lithography, Electron beams, Sensors, Metals, Image processing, Electrons, Inspection, Scanning electron microscopy, Wafer inspection, Semiconducting wafers, Tin, Defect inspection

PROCEEDINGS ARTICLE | October 17, 2014
Proc. SPIE. 9231, 30th European Mask and Lithography Conference
KEYWORDS: Semiconductors, Microfluidics, Metals, Water, Silicon, Chemistry, Photoresist materials, Photoresist processing, Fluid dynamics, Plasma

PROCEEDINGS ARTICLE | March 27, 2014
Proc. SPIE. 9051, Advances in Patterning Materials and Processes XXXI
KEYWORDS: Microelectromechanical systems, Semiconductors, Contamination, Water, Particles, Silicon, Chemistry, Photoresist materials, Photoresist processing, Semiconducting wafers

PROCEEDINGS ARTICLE | March 29, 2013
Proc. SPIE. 8685, Advanced Etch Technology for Nanopatterning II
KEYWORDS: Optical lithography, Silica, Etching, Crystals, Silicon, Surface roughness, Atomic layer deposition, Photomasks, Zirconium dioxide, Plasma

PROCEEDINGS ARTICLE | March 21, 2012
Proc. SPIE. 8323, Alternative Lithographic Technologies IV
KEYWORDS: Lithography, Electron beam lithography, Etching, Silicon, Photomasks, Beam shaping, Electron beam direct write lithography, Semiconducting wafers, Optics manufacturing, 193nm lithography

Showing 5 of 6 publications
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