In large-scale production, reducing the processing time while maintaining high precision is of crucial importance in order to reduce production cost and guarantee high quality. To achieve this aim, a line beam system combined with a 150 W excimer laser is introduced. UV excimer laser radiation has proven itself for precise structuring and modifying of microand nanometer-scale layers. With a wavelength of 248 nm, materials can be selectively modified with a depth resolution below 0.1 micrometers. Due to the latest technical development, high power excimer laser bridges the gap between high precision and cost-efficient processing. <p> </p>The linear beam concept dispenses with movable components such as scanner optics. By using a fixed line beam with ns pulse duration, a system with optimum reproducibility has been created. The functionality of the novel line beam system and the attainable layer quality are evaluated individually and form the basis for rapidly implementing the UV system in industrial applications. One application example presented in this paper is the reduction of graphene oxide for waferscale fabrication of reduced graphene oxide.
A novel UV line beam system for large area processing is introduced. The linear beam concept dispenses with movable components such as scanner optics. By using a fixed line beam with ns pulse duration and combining it with a 150 W excimer laser as the beam source a system with optimum reproducibility of the resulting layer modification has been created. Depending on the application, the excimer laser beam can be redirected into a high-resolution mask ablation system with rectangular field geometry. This machine’s modular concept can be used for a wide range of materials and laser-processes, especially for large area applications. Two different laser-material processes, thermal ablation and optical modification, are presented demonstrating the variety of the possible functionality of the system.