Matthias Winter
at TDK Electronics AG
SPIE Involvement:
Author
Publications (2)

Proceedings Article | 19 May 2009 Paper
Proceedings Volume 7362, 73620D (2009) https://doi.org/10.1117/12.821186
KEYWORDS: Microelectromechanical systems, Packaging, Ceramics, Polymers, Semiconducting wafers, Acoustics, Reliability, Silicon, Metals, Cell phones

Proceedings Article | 19 May 2009 Paper
Matthias Winter, Seifeddine Ben Aoun, Gregor Feiertag, Anton Leidl, Patrick Scheele, Helmut Seidel
Proceedings Volume 7362, 736214 (2009) https://doi.org/10.1117/12.821187
KEYWORDS: Microelectromechanical systems, Electrodes, Resistance, Acoustics, Tolerancing, Linear filtering, Device simulation, MATLAB, Capacitance, Silicon

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