Matthias Winter
at TDK Electronics AG
SPIE Involvement:
Author
Publications (2)

PROCEEDINGS ARTICLE | May 19, 2009
Proc. SPIE. 7362, Smart Sensors, Actuators, and MEMS IV
KEYWORDS: Microelectromechanical systems, MATLAB, Electrodes, Silicon, Resistance, Linear filtering, Capacitance, Acoustics, Tolerancing, Device simulation

PROCEEDINGS ARTICLE | May 19, 2009
Proc. SPIE. 7362, Smart Sensors, Actuators, and MEMS IV
KEYWORDS: Microelectromechanical systems, Packaging, Cell phones, Polymers, Metals, Ceramics, Silicon, Reliability, Acoustics, Semiconducting wafers

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