IR imaging (2D radiation mapping) of forward biased point contact LEDs based on p-InAsSbP/n-InAs/n-InAsSbP DHs
and p-InAsSbP/n-InAs SHs revealed differences in current crowding effect that was attributed to the properties of
isotype n-InAsSbP/n-InAs barrier. 2D radiation distribution has been used for determination of L-I and I-V
characteristics that are not distorted by the current crowding. The existence of the n-InAsSbP/n-InAs barrier was also
traced in AFM and C-V measurements.
We present L-I, I-V and spectral characteristics at 300 and 77 K of the flip-chip LED arrays based on p-InAsSbP/n-
InGaAsSb heterostrucutres with photonic crystal formed onto an outcoupling n+-InAs substrate. We also describe results
on IR imaging (2D radiation mapping) and near and far field patterns in forward biased LEDs.
InGaAsSb narrow gap heterostructures with p-InAsSbP claddings grown onto heavily doped n+-InAs substrates have
been processed into 70 μm wide square mesas lined in a 1x4 array with individual addressing of elements. We report I-V,
L-I characteristics of the array as well as IR images allowing characterization of cross talk, reflectance of the contacts
and apparent temperatures in the spectral range around 3.6 μm. Reflectance and outcoupling efficiency is presented for
photonics crystal structures with regard to their implementation in LED assemblies.
InAs and InAs(Sb)(P) based heterostructures with InAsSbP claddings grown onto heavily doped or undoped n-InAs
substrates have been processed into 230÷430 &mgr;m wide mesa flip-chip devices operating in the 3÷5 &mgr;m spectral range.
We present temperature dependence of I-V, RoA, SI and D* as well as the dependence on a photon energy in uncoated
backside illuminated and equipped with an immersion lens photodiodes respectively. Room temperature D*&lgr; as high as
(1.75x1011÷3x108) cmHz1/2W-1 was achieved in photodiodes with Si lens having effective diameter of 3.3 mm and operating in the 3÷5 &mgr;m range correspondingly.
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