Melia Tjio
at
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Publications (9)

PROCEEDINGS ARTICLE | March 20, 2015
Proc. SPIE. 9425, Advances in Patterning Materials and Processes XXXII
KEYWORDS: Thin films, Etching, Dry etching, Polymers, Annealing, Coating, Scanning electron microscopy, Directed self assembly, Plasma etching, Photomicroscopy

PROCEEDINGS ARTICLE | March 19, 2015
Proc. SPIE. 9423, Alternative Lithographic Technologies VII
KEYWORDS: Electron beam lithography, Polymethylmethacrylate, Etching, Image segmentation, Composites, Scanning electron microscopy, Photomasks, Directed self assembly, Picosecond phenomena, System on a chip

PROCEEDINGS ARTICLE | March 31, 2014
Proc. SPIE. 9052, Optical Microlithography XXVII
KEYWORDS: Lithography, Optical lithography, 3D modeling, Monte Carlo methods, Photomasks, Directed self assembly, Computational lithography, Critical dimension metrology, Photoresist processing, Instrument modeling

PROCEEDINGS ARTICLE | March 28, 2014
Proc. SPIE. 9049, Alternative Lithographic Technologies VI
KEYWORDS: Polymethylmethacrylate, Defect detection, Etching, Image processing, Silicon, 3D modeling, Scatterometry, Directed self assembly, Line edge roughness, Semiconducting wafers

PROCEEDINGS ARTICLE | April 12, 2013
Proc. SPIE. 8683, Optical Microlithography XXVI
KEYWORDS: Lithography, Optical lithography, Data modeling, 3D modeling, Photomasks, Extreme ultraviolet, Directed self assembly, Source mask optimization, Optical proximity correction, Semiconducting wafers

PROCEEDINGS ARTICLE | March 26, 2013
Proc. SPIE. 8680, Alternative Lithographic Technologies V
KEYWORDS: Lithography, Optical lithography, Polymethylmethacrylate, Etching, Line width roughness, Directed self assembly, Chemical reactions, Critical dimension metrology, Photoresist processing, Semiconducting wafers

Showing 5 of 9 publications
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