Meng-Feng Tsai
Assistant Manager at SCH Electronics Co Ltd
SPIE Involvement:
Author
Publications (6)

PROCEEDINGS ARTICLE | March 29, 2013
Proc. SPIE. 8682, Advances in Resist Materials and Processing Technology XXX
KEYWORDS: Lithography, Optical lithography, Etching, Image processing, Scanning electron microscopy, Process control, Photomasks, Double patterning technology, Chemical reactions, Photoresist processing

PROCEEDINGS ARTICLE | April 16, 2011
Proc. SPIE. 7972, Advances in Resist Materials and Processing Technology XXVIII
KEYWORDS: Lithography, Etching, Printing, Photomasks, Line width roughness, Double patterning technology, Optical alignment, Critical dimension metrology, Photoresist processing, Semiconducting wafers

PROCEEDINGS ARTICLE | March 4, 2010
Proc. SPIE. 7640, Optical Microlithography XXIII
KEYWORDS: Carbon, Lithography, Lithographic illumination, Reflection, Reflectivity, Double patterning technology, Optical proximity correction, Photoresist processing, Resolution enhancement technologies, Bottom antireflective coatings

PROCEEDINGS ARTICLE | March 23, 2009
Proc. SPIE. 7272, Metrology, Inspection, and Process Control for Microlithography XXIII
KEYWORDS: Optical lithography, Etching, Scanners, Manufacturing, Signal processing, Photomasks, Double patterning technology, Optical alignment, Semiconducting wafers, Overlay metrology

PROCEEDINGS ARTICLE | March 16, 2009
Proc. SPIE. 7274, Optical Microlithography XXII
KEYWORDS: Lithography, Electron beam lithography, Etching, Scanners, Manufacturing, Bridges, Photomasks, Double patterning technology, Optical alignment, Semiconducting wafers

PROCEEDINGS ARTICLE | December 4, 2008
Proc. SPIE. 7140, Lithography Asia 2008
KEYWORDS: Lithography, Optical lithography, Etching, Scanners, Manufacturing, Line width roughness, Double patterning technology, Line edge roughness, Semiconducting wafers, 193nm lithography

Showing 5 of 6 publications
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