Michael Cicoria
Applications Engineer at Tokyo Electron America Inc
SPIE Involvement:
Author
Publications (5)

PROCEEDINGS ARTICLE | March 28, 2014
Proc. SPIE. 9049, Alternative Lithographic Technologies VI
KEYWORDS: Polymethylmethacrylate, Defect detection, Etching, Image processing, Silicon, 3D modeling, Scatterometry, Directed self assembly, Line edge roughness, Semiconducting wafers

PROCEEDINGS ARTICLE | March 27, 2014
Proc. SPIE. 9051, Advances in Patterning Materials and Processes XXXI
KEYWORDS: Optical lithography, Polymethylmethacrylate, Etching, Annealing, Scanning electron microscopy, Photoresist materials, Line width roughness, Directed self assembly, Picosecond phenomena, Line edge roughness

PROCEEDINGS ARTICLE | March 29, 2013
Proc. SPIE. 8682, Advances in Resist Materials and Processing Technology XXX
KEYWORDS: Lithography, Etching, Scanning electron microscopy, Line width roughness, Double patterning technology, Chemical reactions, Critical dimension metrology, Line edge roughness, Photoresist processing, Semiconducting wafers

PROCEEDINGS ARTICLE | March 26, 2013
Proc. SPIE. 8680, Alternative Lithographic Technologies V
KEYWORDS: Lithography, Optical lithography, Polymethylmethacrylate, Etching, Line width roughness, Directed self assembly, Chemical reactions, Critical dimension metrology, Photoresist processing, Semiconducting wafers

PROCEEDINGS ARTICLE | March 26, 2013
Proc. SPIE. 8680, Alternative Lithographic Technologies V
KEYWORDS: Lithography, Optical lithography, Polymethylmethacrylate, Etching, Silicon, Coating, Photoresist materials, Finite element methods, Directed self assembly, Picosecond phenomena

SIGN IN TO:
  • View contact details

UPDATE YOUR PROFILE
Is this your profile? Update it now.
Don’t have a profile and want one?

Back to Top