Mr. Michael J. Cooper Profile

Mr. Michael J. Cooper

at MIT Lincoln Lab

SPIE Involvement:

Author

Publications (8)

PROCEEDINGS ARTICLE | September 14, 2011

Radiation testing of mini-orthogonal transfer array CCDs

Proc. SPIE. 8145, UV, X-Ray, and Gamma-Ray Space Instrumentation for Astronomy XVII

KEYWORDS: Staring arrays, Error analysis, X-rays, Space telescopes, Spectral resolution, Charge-coupled devices, X-ray astronomy, Astrophysics, X-ray detectors, Temperature metrology

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PROCEEDINGS ARTICLE | July 24, 2008

Results from the Pan-STARRS Orthogonal Transfer Array (OTA)

Proc. SPIE. 7021, High Energy, Optical, and Infrared Detectors for Astronomy III

KEYWORDS: Point spread functions, Telescopes, Logic, Stars, Cameras, Sensors, Metals, Silicon, Quantum efficiency, Charge-coupled devices

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PROCEEDINGS ARTICLE | February 21, 2007

Orthogonal transfer arrays for the Pan-STARRS gigapixel camera

Proc. SPIE. 6501, Sensors, Cameras, and Systems for Scientific/Industrial Applications VIII

KEYWORDS: Staring arrays, Packaging, Logic, Cameras, Silicon, Ionization, Epoxies, Charge-coupled devices, Molybdenum, Prototyping

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PROCEEDINGS ARTICLE | February 6, 2006

Development of the orthogonal-transfer array

Proc. SPIE. 6068, Sensors, Cameras, and Systems for Scientific/Industrial Applications VII

KEYWORDS: Logic, Clocks, Imaging systems, Metals, Video, Quantum efficiency, Transistors, Field effect transistors, Charge-coupled devices, Semiconducting wafers

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PROCEEDINGS ARTICLE | September 29, 2004

The orthogonal-transfer array: a new CCD architecture for astronomy

Proc. SPIE. 5499, Optical and Infrared Detectors for Astronomy

KEYWORDS: Astronomy, Logic, Clocks, Stars, Imaging systems, Metals, Video, Charge-coupled devices, Semiconducting wafers, Prototyping

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PROCEEDINGS ARTICLE | May 15, 2000

Merged CCD/SOI-CMOS technology

Proc. SPIE. 3965, Sensors and Camera Systems for Scientific, Industrial, and Digital Photography Applications

KEYWORDS: Oscillators, Imaging systems, Image processing, Silicon, Scanning electron microscopy, Imaging devices, Charge-coupled devices, CMOS technology, Semiconducting wafers, New and emerging technologies

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PROCEEDINGS ARTICLE | November 19, 1993

CCD soft x-ray imagers for ASCA and AXAF

Proc. SPIE. 2006, EUV, X-Ray, and Gamma-Ray Instrumentation for Astronomy IV

KEYWORDS: Packaging, Imaging systems, Satellites, Spectroscopy, X-rays, Silicon, Charge-coupled devices, X-ray imaging, Imaging arrays, Semiconducting wafers

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PROCEEDINGS ARTICLE | August 28, 1992

High-performance visible-UV CCD imagers for space-based applications

Proc. SPIE. 1693, Surveillance Technologies II

KEYWORDS: Visible radiation, Clocks, Imaging systems, Ultraviolet radiation, Silicon, Quantum efficiency, Surveillance, Charge-coupled devices, Back illuminated sensors, Semiconducting wafers

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Showing 5 of 8 publications

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