KEYWORDS: Semiconducting wafers, Photoresist materials, Signal to noise ratio, Signal processing, Manufacturing, Control systems, Photoresist developing, Humidity, Data modeling, Environmental monitoring
Technical requirements for advanced manufacturing processes require strict photoresist photospeed control. To meet this need, it is necessary to determine the error associated with measuring photospeed at both the photoresist supplier and user Fabs. This paper described two studies targeted at determining and improving the photospeed test error at both the supplier and user Fabs. The initial work focused on understanding each company's test methodologies, respective capabilities and sources of variation. This consisted of a 48-hour photospeed repeatability test during which process and environmental conditions were monitored. Through brainstorming and the results of the repeatability study, factors affecting the signal-to-noise were identified and evaluated in a designed experiment.
Conference Committee Involvement (6)
Metrology, Inspection, and Process Control for Microlithography XXII
25 February 2008 | San Jose, California, United States
Metrology, Inspection, and Process Control for Microlithography XXI
26 February 2007 | San Jose, California, United States
Metrology, Inspection, and Process Control for Microlithography XX
20 February 2006 | San Jose, California, United States
Metrology, Inspection, and Process Control for Microlithography XIX
28 February 2005 | San Jose, California, United States
Metrology, Inspection, and Process Control for Microlithography XVIII
23 February 2004 | Santa Clara, California, United States
Metrology, Inspection, and Process Control for Microlithography XVII
24 February 2003 | Santa Clara, California, United States
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