High-speed electronic integrated circuits are essential to the development of new fiber-optic communication systems. As a consequence of the increasing speeds and multi-channel operation, close integration and co-design of photonic and electronic devices have become a necessity to realize high-performance sub-systems. Such co-design on the other hand also enables the design of new electro-optic architectures to create and process multi-level optical signals. This presentation will illustrate a number of recent and ongoing developments in IDLab, an imec research group, from various H2020 projects with a focus on application-specific high-speed electronic transceiver circuits such as driver amplifiers and transimpedance amplifiers (TIAs).
To address the challenges of the Digital Agenda for Europe (DAE) and also to remain in line with the evolution of terrestrial communications in a globally connected world, a major increase in telecoms satellites capacity is required in the near future.
With telecom satellites payloads based on traditional RF equipment, increase in capacity and flexibility has always translated into a more or less linear increase in equipment count, mass, power consumption and power dissipation.
The main challenge of next generation of High Throughput Satellites (HTS) is therefore to provide a ten-fold-increased capacity with enhanced flexibility while maintaining the overall satellite within a “launchable” volume and mass envelope , , . Photonic is a very promising technology to overcome the above challenges. The ability of Photonic to handle high data rates and high frequencies, as well as enabling reduced size, mass, immunity to EMI and ease of harness routing (by using fibre-optic cables) is critical in this scenario.