Ceramics are commonly used as substrates in electrically insulated integrated circuit, printed circuit board, and lightemitting
diode industries because of their excellent dielectric and thermal properties. However, brittle materials (e.q.,
ceramic alumina, sapphire, glass, and silicon wafer) are difficult to fabricate using wheel tools. Laser material processes
are preferred over traditional methods because they allow noncontact processing, avoid tool wear problems, and achieve
high speed, high accuracy, and high resolution. Laser material processes also exhibit minimal residual thermal effects
and residual stress. This study investigated the laser drilling of Al2O3 ceramic material (with a thickness of 380 μm and
hole diameters of 200, 300, and 500 μm, respectively) by using a laser milling method. The macro- and micro-hole
milling performance depended on various parameters including the galvanometric scan speed and milling time. A 3D
confocal laser scanning microscope and a field-emission scanning electron microscope were used to measure the surface
morphology, taper angle, and melted residual height of the machined surface after laser milling. The edge quality and
roundness of laser milling were also observed using image-processing edge-detection technology.
The purpose of this paper is the microvia results of different materials (RCC, FR4 and Cu) using CO2 laser drilling machine at the wavelength of 10600 nm. We investigated the mechanism of this process with CO2 laser and the microvia results of different materials. The microvia with a diameter up to 150 microns through laser drilling are presented. In this paper we report the results of a dielectric material such as the RCC and FR4 which used the different parameter of laser. In addition, the high power required for drilling copper foil compared to the resin material is due to the low absorption and high reflection of copper around 10600 nm wavelengths. We will present the method of the copper drilling based on a CO2 laser drilling machine system which used the low power.
Laser processing which used in the 3C industry is the new technology. The PCB (printed circuit board) Laser drilling is the new manufacturing process for the PCB industry. In this paper we report the results of an investigation exploring the feasibility of laser drilling microvias. The process relies on the use of pulses from a CO2 laser to drilling small holes in the panels of acrylic. There are two part of this paper, first we will drilling the small holes of the acrylic by the different parameter of the laser (pulse width, repetitive frequency, mask size and etc.). There are two result of this paper; first we find the repetitive frequency and mask size will be change the holes diameter and depth, and the pulse width will affect the quality of the drilling holes. In Addition we can find the optimal process parameter by this paper.