Ming-Hsun Hsieh
at United Microelectronics Corp
SPIE Involvement:
Author
Publications (5)

Proceedings Article | 5 April 2007
Proc. SPIE. 6518, Metrology, Inspection, and Process Control for Microlithography XXI
KEYWORDS: Semiconductors, Error analysis, Nondestructive evaluation, Atomic force microscopy, Scanning electron microscopy, Transmission electron microscopy, Line width roughness, Optical proximity correction, Critical dimension metrology, Line edge roughness

Proceedings Article | 24 March 2006
Proc. SPIE. 6152, Metrology, Inspection, and Process Control for Microlithography XX
KEYWORDS: Polishing, Metrology, Sensors, Copper, Ultrasonics, Transmission electron microscopy, Picosecond phenomena, Semiconducting wafers, Signal detection, Chemical mechanical planarization

Proceedings Article | 24 March 2006
Proc. SPIE. 6152, Metrology, Inspection, and Process Control for Microlithography XX
KEYWORDS: Oxides, Etching, Silicon, Nondestructive evaluation, Photodiodes, Atomic force microscopy, Scanning electron microscopy, Transmission electron microscopy, Process control, Semiconducting wafers

Proceedings Article | 9 September 2004
Proc. SPIE. 5380, Optical Data Storage 2004
KEYWORDS: Refractive index, Crystals, Germanium, Dielectrics, Reflectivity, Transmittance, Optical recording, Antimony, Gallium, Temperature metrology

Proceedings Article | 23 September 1996
Proc. SPIE. 2879, Micromachining and Microfabrication Process Technology II
KEYWORDS: Microelectromechanical systems, Etching, Crystals, Silicon, Photomasks, Wet etching, Optical alignment, Semiconducting wafers, Anisotropic etching, Wafer bonding

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