The objective of this study was to examine the defect reduction effect of the wafer edge polishing step on the
immersion lithography process. The experimental wafers were processed through a typical front end of line device
manufacturing process and half of the wafers were processed with the wafer edge polishing just prior to the immersion
lithography process. The experimental wafers were then run through two immersion lithography experiments and the
defect adders on these wafers were compared and analyzed. The experimental results indicated a strong effect of the
edge polishing process on reducing the particle migration from the wafer edge region to the wafer surface during the
immersion lithography process.