An numerical model considering solder viscoplasticity is developed to analyze the thermal deformation of laser disk with indium bonded. The characteristic of soft bonding material is described using Anand viscoplasticity model. The Finite Element Method analytical results show that the back surface of laser disk with pumping will deform more significantly with time and finally be steady. Correspondingly the refraction power increase gradually and diffraction loss induced by aspherical aberration decrease gradually. Futhermore when pump spot is larger the refraction power and aspherical aberration will change more due to solder viscoplasticity.