In the present work the scope of using micro-electro discharge machining (micro-EDM) technique to generate metalnanoparticles
is studied and thermal conductivity of the fluid with particles generated using micro-EDM is characterized.
In the experiment, aluminum workpiece is machined with an aluminum tool electrode in deionized water. 40 to 96 V is
applied for machining with pulse-on duration being varied between 10 and 100 microseconds. The particle count analysis
reveals that low voltage and high pulse-on duration favors formation of smaller sized particles, as predicted by the
developed model. A thermal conductivity measurements show 4% rise in thermal conductivity with the sample (0.004%
by wt. in deionized water) produced by micro-EDM setup.
A micro-electro-discharge machine (Micro EDM) was developed incorporating a piezoactuated direct drive tool feed
mechanism for micromachining of Silicon using a copper tool. Tool and workpiece materials are removed during Micro
EDM process which demand for a tool wear compensation technique to reach the specified depth of machining on the
workpiece. An in-situ axial tool wear and machining depth measurement system is developed to investigate axial wear
ratio variations with machining depth. Stepwise micromachining experiments on silicon wafer were performed to
investigate the variations in the silicon removal and tool wear depths with increase in tool feed. Based on these
experimental data, a tool wear compensation method is proposed to reach the desired depth of micromachining on silicon
using copper tool. Micromachining experiments are performed with the proposed tool wear compensation method and a
maximum workpiece machining depth variation of 6% was observed.
A prototype microelectrodischarge machine (micro-EDM) with a piezoactuated tool feed mechanism has been developed. In micro-EDM, the tool also experiences continuous wear during machining. This necessitates a tool wear compensation technique to attain a specified depth of micromachining on the workpieces. Tool wear compensation studies are performed during micromachining of silicon wafers using a copper tool. In order to estimate the necessary tool wear compensation, an axial tool wear and micromachined hole-depth measurement technique is incorporated, and variation in wear ratio at different depths of micromachining is investigated. Process simulation of micro-EDM is also performed to estimate the tool wear compensation required to reach a predefined depth during micromachining on silicon. Results obtained by simulation for the required tool feed, depth of hole achieved corresponding to a set value, and the resulting axial tool wear are in close agreement with experimental results. A machining depth variation of about 6% with respect to the estimated depth is observed. This approach provides a process control methodology for mircromachining of semiconductor and conducting materials to predefined depth with high accuracy.