Dr. Myungjun Lee
Corporate Vice President
SPIE Involvement:
Conference Program Committee | Author
Area of Expertise:
Computational optics , Optical Metrology and inspection , Lithography , Scatterometry , Holographic imaging , Nonlinear optics
Profile Summary

Myungjun Lee is the vice president and the head of the Metrology and Inspection team at Samsung Electronics, where he leads the development of cutting-edge metrology and inspection solutions essential for semiconductor chip manufacturing. Before joining Samsung in 2017, he gained valuable experience working at several prominent companies, including KLA-Tencor, the Strategic Lithography Team at GlobalFoundries (the pathfinding patterning team at IBM) in Albany, NY, as well as at Nanometrics, where he contributed to the development of diverse patterning and metrology solutions. Between 2010 and 2011, he served as a postdoctoral fellow in the Electrical Engineering department at UCLA, working with Prof. Aydogan Ozcan on computational imaging & microscopy techniques.

Dr. Lee earned his Ph.D. degree in electrical computer engineering and optical science from the University of Arizona under the guidance of Prof. Mark A. Neifeld in 2010. He also holds a master's degree from Texas A&M University, earned in 2005 under the mentorship of Prof. Henry F. Taylor, and a bachelor's degree from Korea University, completed in 2002.

Dr. Lee's extensive contributions to the field include authoring and co-authoring more than 70 journal and conference papers and securing over 50 US patents for a range of optical system designs and their applications in optical imaging, sensing, communications, semiconductor patterning, and metrology.
Publications (24)

Proceedings Article | 10 April 2024 Poster
Proceedings Volume 12955, 129552U (2024) https://doi.org/10.1117/12.3010488
KEYWORDS: Semiconducting wafers, High volume manufacturing, Metrology, Copper, Chemical mechanical planarization, Surface finishing, Semiconductor manufacturing, Process control, Miniaturization, Atomic force microscopy

Proceedings Article | 10 April 2024 Presentation + Paper
Proceedings Volume 12955, 129550Y (2024) https://doi.org/10.1117/12.3009407
KEYWORDS: Image segmentation, Transmission electron microscopy, Image processing, Metrology, Electron microscopes, Active learning

Proceedings Article | 15 August 2023 Presentation + Paper
Proceedings Volume 12618, 126180B (2023) https://doi.org/10.1117/12.2677195
KEYWORDS: Objectives, Beam splitters, Polarization, Temperature metrology, Ellipsometry, Error analysis, Optical components

Proceedings Article | 10 August 2023 Presentation + Paper
Proceedings Volume 12619, 126190G (2023) https://doi.org/10.1117/12.2680983
KEYWORDS: Scattering, Neural networks, Light scattering, Diffraction, Data modeling, Machine learning

Proceedings Article | 27 April 2023 Paper
Proceedings Volume 12496, 124962X (2023) https://doi.org/10.1117/12.2658131
KEYWORDS: Critical dimension metrology, Semiconducting wafers, Metrology, Semiconductors, Mueller matrices, Ellipsometry, Inspection

Showing 5 of 24 publications
Conference Committee Involvement (5)
Metrology, Inspection, and Process Control XXXIX
23 February 2025 | San Jose, California, United States
Metrology, Inspection, and Process Control XXXVIII
26 February 2024 | San Jose, California, United States
Metrology, Inspection, and Process Control XXXVII
27 February 2023 | San Jose, California, United States
Metrology, Inspection, and Process Control XXXVI
25 April 2022 | San Jose, California, United States
Metrology, Inspection, and Process Control for Semiconductor Manufacturing XXXV
22 February 2021 | Online Only, California, United States
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