Hall sensors of high sensitivity have been designed and fabricated using the Micro-Electro-Mechanical System
(MEMS) process. This paper presents the design and fabrication techniques used to obtain high sensitivity Hall sensors
on a thin film polyimide flexible substrate. The devices are fabricated on a Silicon-on-Insulator (SOI), with boron-doped
p-type Silicon as the active layer, using surface micromachining principles. The arrays of Hall devices are further
transferred to a flexible substrate using a combination of wet and dry micromachining processes. The manufactured
devices are stable over a range of temperature displaying relatively high magnetic sensitivity values. The recorded device
sensitivities are in the range of 10μV/mA-G. The fabrication process aims at fabricating devices on a flexible substrate
that enables to curve the Hall probes and thus use them for the measurement of radial magnetic fields and magnetic fields
on curved surfaces. The volume of the active region is 1000×100×2μm.
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