Naya Ha
at SAMSUNG Electronics Co Ltd
SPIE Involvement:
Author
Publications (6)

Proceedings Article | 29 March 2013 Paper
Byung-Moo Kim, Naya Ha, Hung bok Choi , Kee sup Kim , Evan Lee, Wael ElManhawy, Sarah Mohamed, Jae-Hyun Kang, Jean-Marie Brunet, Joe Kwan, Kareem Madkour
Proceedings Volume 8684, 86840N (2013) https://doi.org/10.1117/12.2011619
KEYWORDS: Lithography, Double patterning technology, Design for manufacturing, Resolution enhancement technologies, Manufacturing, Bridges, Visualization, Design for manufacturability, Metals, Electronics

Proceedings Article | 15 March 2012 Paper
Shady Abdelwahed, Seung Weon Paek, Kee Sup Kim, Jae-Hyun Kang, Byung-Moo Kim, Hungbok Choi, Mohamed Imam, Naya Ha, Ahmed Mohy, Joo-Hyun Park
Proceedings Volume 8327, 83270P (2012) https://doi.org/10.1117/12.917998
KEYWORDS: Semiconducting wafers, Metals, Process modeling, Image processing, Design for manufacturing, Chemical mechanical planarization, Optical proximity correction, 3D modeling, Photovoltaics, Scanning electron microscopy

Proceedings Article | 15 March 2012 Paper
Philippe Hurat, Jae-Hyun Kang, Hungbok Choi, Ya-Chieh Lai, Wilbur Luo, Seung Weon Paek, Kee Sup Kim, Daehyun Jang, Naya Ha, Junsu Jeon
Proceedings Volume 8327, 83270S (2012) https://doi.org/10.1117/12.916199
KEYWORDS: Silicon, Manufacturing, Lithography, Failure analysis, Data processing, Chemical mechanical planarization, Semiconducting wafers, Design for manufacturability, Tolerancing, Optical lithography

Proceedings Article | 15 March 2012 Open Access Paper
Woonhyuk Choi, YoungKi Hong, Kee Sup Kim, Kyu-Myung Choi, JoongWon Jeon, DongSup Song, Sung-eun Yu, SangMin Bae, WooYoung Noh, JinWoo Lee, Junsu Jeon, HyunSeok Song, DaeWook Kim, HungBok Choi, Joo Hyun Park, Naya Ha, Jae Hyun Kang, Seung Weon Paek, Dae-Hyun Jang, BongSeok Kim, No-Young Chung, SeongHo Park, KangDuck Lee, Byung-Moo Kim, YoungDuck Kim, Ki-Su Kim, Kun Young Chung
Proceedings Volume 8327, 832704 (2012) https://doi.org/10.1117/12.920029
KEYWORDS: Design for manufacturing, Silicon, Polishing, Optical proximity correction, Back end of line, Metals, Failure analysis, Yield improvement, Logic, Manufacturing

Proceedings Article | 5 April 2011 Paper
Naya Ha, Kuang Han Chen, Kee Sup Kim, Philippe Hurat, Tamba Gbondo-Tugbawa, S. W. Paek, Aaron Gower-Hall, Jinwoo Lee
Proceedings Volume 7974, 79740W (2011) https://doi.org/10.1117/12.880899
KEYWORDS: Chemical mechanical planarization, Metals, Copper, System on a chip, Design for manufacturing, Manufacturing, Dielectrics, Polishing, Device simulation, Logic

Showing 5 of 6 publications
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