Nico Funck
at Fraunhofer-ISIT
SPIE Involvement:
Author
Publications (2)

Proceedings Article | 28 February 2020 Presentation + Paper
Proc. SPIE. 11293, MOEMS and Miniaturized Systems XIX
KEYWORDS: Microelectromechanical systems, Actuators, Mirrors, Optical lithography, Electrodes, Dielectrics, Deep reactive ion etching, Semiconducting wafers, Wafer bonding, Piezoelectric thin film actuators

Proceedings Article | 4 March 2019 Presentation + Paper
Proc. SPIE. 10931, MOEMS and Miniaturized Systems XVIII
KEYWORDS: Microelectromechanical systems, Actuators, Mirrors, Ferroelectric materials, Electrodes, Finite element methods, Deep reactive ion etching, Molybdenum, Semiconducting wafers, Wafer bonding

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