Dr. Nigel C. E. Crosland Profile

Dr. Nigel C. E. Crosland

Senior Scientist at Vistec Gaussian Beam Lithography

SPIE Involvement:

Author

Publications (3)

Proceedings Article | 28 March 2014 Paper

Increased throughput, determined by a suite of benchmark patterns, in a Gaussian electron-beam lithography tool with a 100 MHz writing rate

James Smith, Nigel Crosland, Samuel Doran, Robert Dowling, John Hartley, Philip Hoyle, David M. King, Lawrence Kutcher, Andrew McClelland, Martin Turnidge

Proceedings Volume 9049, 90490O (2014) https://doi.org/10.1117/12.2046609

KEYWORDS: Lithography, Double patterning technology, Analog electronics, Clocks, Photomicroscopy, Beam shaping, Computer programming, Semiconducting wafers, Metals, Metrology

Read Abstract +

Proceedings Article | 26 March 2013 Paper

Quantifying throughput improvements for electron-beam lithography using a suite of benchmark patterns

John Hartley, Nigel Crosland, Robert Dowling, Philip Hoyle, Andrew McClelland, Martin Turnidge, James Smith

Proceedings Volume 8680, 86800P (2013) https://doi.org/10.1117/12.2011664

KEYWORDS: Lithography, Semiconducting wafers, Zone plates, Computer programming, Beam shaping, Data conversion, Metals, Photomicroscopy, Metrology, Time metrology

Read Abstract +

Proceedings Article | 3 April 2010 Paper

Operation and performance of the CNSE Vistec VB300 electron beam lithography system

J. Hartley, T. Groves, R. Bonam, A. Raghunathan, J. Ruan, A. McClelland, N. Crosland, J. Cunanan, K. Han

Proceedings Volume 7637, 76371Y (2010) https://doi.org/10.1117/12.848396

KEYWORDS: Semiconducting wafers, Electron beam lithography, Metals, Lithography, Contamination, X-ray fluorescence spectroscopy, Overlay metrology, Calibration, Monochromatic aberrations, X-rays

Read Abstract +

At the end of 2008, the College of Nanoscale Science and Engineering (CNSE) formally accepted a Vistec VB300 Gaussian electron beam lithography system. The system is a key component of the overall lithography strategy of the College and complements existing state of the art tooling for 193nm immersion, Extreme Ultra Violet and nanoimprint. The demonstrated resolving power of the system easily exceeds that of the facility's optical scanners. Together with 300mm wafer compatibility, and a class 1 mini environment, the system is well poised to execute its primary mission of supporting a variety of programs in post CMOS device integration. For a 300mm tool to be able to exchange wafers with other tooling in a full flow line it is necessary to pass stringent backside metal contamination testing. TXRF (total reflection x-ray fluorescence) testing performed with 300mm wafers on the VB300 satisfied the permitted metal contamination levels and cleared the way for introduction of ebeam patterned wafers into the process flow. Most of the tooling in the 300mm line handles wafers in front opening universal pods (FOUPS). With the relatively low throughput of the system (hours per wafer, not wafers per hour), this type of interface is not required. In order to maintain a low level of defects, 300mm wafers are removed from the FOUPS in the class 1 mini environment and loaded into the system. In addition to the 300mm capability, the system supports a wide range of wafer sizes, photomasks and piece parts. This enables the platform to support the 200mm activities at the College as well as the small samples frequently encountered with novel materials that have no support tooling available for 200mm and 300mm wafer sizes. The VB300 platform readily met the Vistec standard acceptance test specifications. The paper presents details of the acceptance test together with examples of additional work in progress that includes implementation of rigorous tool monitor standards, imprint template fabrication and mix and match overlay between the VB300 and optical patterning tools.

View contact details

UPDATE YOUR PROFILE

Is this your profile? Update it now.

Sign into your SPIE.org account

Don’t have a profile and want one?

Create an account on SPIE.org

Keywords/Phrases

Search In:

Publication Years