Ofer Adan
Senior Member of Technical Staff at Applied Materials Ltd
SPIE Involvement:
Conference Co-Chair | Conference Program Committee | Editor | Author | Instructor
Publications (36)

PROCEEDINGS ARTICLE | March 28, 2016
Proc. SPIE. 9782, Advanced Etch Technology for Nanopatterning V
KEYWORDS: Signal to noise ratio, Lithography, Optical lithography, Statistical analysis, Etching, Scanning electron microscopy, Line width roughness, Line edge roughness, Stochastic processes, Edge roughness

PROCEEDINGS ARTICLE | March 24, 2016
Proc. SPIE. 9778, Metrology, Inspection, and Process Control for Microlithography XXX
KEYWORDS: Metrology, Polymethylmethacrylate, Diffractive optical elements, Image segmentation, Image processing, Materials processing, Scanning electron microscopy, Directed self assembly, Picosecond phenomena, Semiconducting wafers

SPIE Journal Paper | July 3, 2015
JM3 Vol. 14 Issue 02
KEYWORDS: Transistors, Semiconducting wafers, Silicon, Scanning electron microscopy, Device simulation, Image segmentation, Resistance, Etching, Line width roughness, Data modeling

PROCEEDINGS ARTICLE | April 10, 2015
Proc. SPIE. 9424, Metrology, Inspection, and Process Control for Microlithography XXIX
KEYWORDS: Oxides, Electron beams, Metrology, Dielectrics, Silicon, Scanning electron microscopy, Silicon films, Boron, Semiconducting wafers, Nanowires

PROCEEDINGS ARTICLE | March 19, 2015
Proc. SPIE. 9424, Metrology, Inspection, and Process Control for Microlithography XXIX
KEYWORDS: Metrology, Image segmentation, Atomic force microscopy, Optical testing, Scanning electron microscopy, 3D metrology, Critical dimension metrology, Semiconducting wafers, Overlay metrology, Back end of line

Showing 5 of 36 publications
Conference Committee Involvement (13)
Metrology, Inspection, and Process Control for Microlithography XXXIII
25 February 2019 | San Jose, California, United States
Metrology, Inspection, and Process Control for Microlithography XXXII
26 February 2018 | San Jose, California, United States
Metrology, Inspection, and Process Control for Microlithography XXXI
27 February 2017 | San Jose, California, United States
Metrology, Inspection, and Process Control for Microlithography XXX
22 February 2016 | San Jose, California, United States
Metrology, Inspection, and Process Control for Microlithography XXIX
23 February 2015 | San Jose, California, United States
Showing 5 of 13 published special sections
Course Instructor
SC1133: Advanced concepts in Metrology Toolset Stability and Matching
The course covers advanced concepts for metrology toolset stability and matching. It will cover many critical topics that together maximize fleet performance. This is especially important given the shift to new device architectures (finfet, 3D Flash, DRAM and advanced memory ) that are challenging metrology toolsets in ways not seen before. A number of advanced concepts will be covered. Review best known methods for gauge study analysis and metrics. Appropriately setting up tool control chart limits for long term stability fleet matching based on requirements not historical data. Leveraging real time normalized product data to decrease Mean Time To Detect (MTTD) tool drifts. Recipe portability matching and monitoring to catch other issues that will affect lot cycletime. The concepts discussed are applicable to any metrology toolset such as CD-SEM, overlay, thin film, AFM, etc. and most of these concepts are also applicable to defect toolsets.
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