Mr. Oliver Brux Profile

Oliver Brux

Senior Product Manager at SUSS MicroTec Solutions

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Publications (4)

Proceedings Article | 30 June 2012 Paper

Challenges and solutions ensuring EUVL photomask integrity

O. Brux, P. Dreß, H. Schmalfuß, R. Jonckheere, W. Koolen-Hermkens

Proceedings Volume 8441, 84411J (2012) https://doi.org/10.1117/12.978198

KEYWORDS: Particles, Photomasks, Extreme ultraviolet lithography, Extreme ultraviolet, Inspection, Contamination, Scanners, Reticles, Carbon dioxide, Nickel

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Industry roadmaps indicate that the introduction of Extreme Ultraviolet Lithography (EUVL) is on track for high volume manufacturing. Although, there has been significant progress in each of the individual subsets of the EUVL infrastructure, the absolute management of the process outside of the scanner and up to the point-of-exposure has been highlighted as critical requirement for the adoption of EUVL. Significant changes in the EUV system environment and mask architecture are driving a zero process tolerance level. Any unforeseen contamination introduced to the scanner environment from the EUV mask could cause considerable downtime and yield loss. Absolute mask integrity at the point-of-exposure must be guaranteed. EUV mask cleaning processes-of-record have been developed and introduced to the industry [1]. The issue is not longer "how to clean the mask" but, "how to keep it clean". With the introduction of EUVL, mask cleanliness extends out beyond the traditional mask cleaning tool. Complete control of contamination and/or particles during transportation, handling and storage will require a holistic approach to mask management. A new environment specifically for EUV mask integrity must be developed and fully tested for the sub 16nm half-pitch node introduction. The SUSS MaskTrack® Pro (MTP) InSync was introduced as the solution for EUV mask integrity. SUSS demonstrated the fully automated handling of EUV masks into and out of a Dual Pod System [2]. Intrinsic cleanliness of each individual handling and storage step of the inner pod (EIP) and EUV mask inside the MTP InSync Tool was investigated and reported. A target specification of a PRP ≤ 0.08 as criterion for the cross contamination between EIP and the EUV reticle during handling within MTP InSync has been achieved and therefore proofing the applicability for the Dual Pod automation. Moreover an appropriate automated handling, other aspects like backside particle contamination and EIP cleanliness plays a significant role to ensure EUV mask integrity. With this concept in mind a system for particle detection has been integrated into MTP InSync. This allows verifying the POR performance for backside cleaning by measuring particles down to 150nm size. A dynamic capture rate of larger 97% at 200nm particle size based on PSLs was achieved; for EIP cleaning, a dry-cleaning technology is under investigation. During feasibility studies high particle removal efficiency (PRE) results larger 99% has been achieved for particles down to 100nm. In this paper, the full scope and roadmap of the MTP InSync will be discussed. Preliminary results of backside particle detection and challenges on EUV Inner Pod (EIP) cleaning will be presented.

Proceedings Article | 17 April 2012 Paper

Integrated cleaning and handling automation of NXE3100 reticles

Rik Jonckheere, Tobias Waehler, Bart Baudemprez, Uwe Dietze, Peter Dress, Oliver Brux, Kurt Ronse

Proceedings Volume 8352, 83520U (2012) https://doi.org/10.1117/12.923321

KEYWORDS: Reticles, Particles, Scanners, Extreme ultraviolet, Photomasks, Extreme ultraviolet lithography, Contamination, Inspection, Semiconducting wafers, Surface roughness

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Proceedings Article | 14 October 2011 Paper

Investigating the intrinsic cleanliness of automated handling designed for EUV mask pod-in-pod systems

O. Brux, P. van der Walle, J. C. J. van der Donck, P. Dress

Proceedings Volume 8166, 81662S (2011) https://doi.org/10.1117/12.896908

KEYWORDS: Particles, Photomasks, Extreme ultraviolet, Reticles, Extreme ultraviolet lithography, Semiconducting wafers, Aluminum, Scanners, Nickel, Contamination

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Proceedings Article | 8 April 2011 Paper

Particle qualification procedure for the TNO EUV reticle load port module of the HamaTech MaskTrackPro cleaning tool

J. Stortelder, J. C. J. van der Donck, S. Oostrom, P. van der Walle, O. Brux, P. Dress

Proceedings Volume 7969, 79691Q (2011) https://doi.org/10.1117/12.879370

KEYWORDS: Particles, Reticles, Extreme ultraviolet, Inspection, Inspection equipment, Fiber optic handling equipment, Extreme ultraviolet lithography, Particle contamination, Contamination, Lithography

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