Dr. Osamu Inoue
at Hitachi High-Technologies Corp
SPIE Involvement:
Author
Publications (20)

PROCEEDINGS ARTICLE | March 28, 2017
Proc. SPIE. 10145, Metrology, Inspection, and Process Control for Microlithography XXXI
KEYWORDS: Oxides, Metrology, Logic, Statistical analysis, Etching, Germanium, Resistance, Scanning electron microscopy, 3D metrology, Process control, Critical dimension metrology, Algorithm development, Overlay metrology, Standards development, Back end of line

PROCEEDINGS ARTICLE | March 28, 2017
Proc. SPIE. 10145, Metrology, Inspection, and Process Control for Microlithography XXXI
KEYWORDS: Edge detection, Metrology, Statistical analysis, Calibration, Etching, Reliability, Resistance, Magnetism, Electron microscopes, Process control, Critical dimension metrology, Semiconducting wafers, Lawrencium

PROCEEDINGS ARTICLE | March 28, 2017
Proc. SPIE. 10145, Metrology, Inspection, and Process Control for Microlithography XXXI
KEYWORDS: Semiconductors, Lithography, Optical lithography, Silica, Sensors, Scanners, Manufacturing, Scanning electron microscopy, Photomasks, Semiconductor manufacturing, Semiconducting wafers, Overlay metrology

PROCEEDINGS ARTICLE | April 27, 2016
Proc. SPIE. 9778, Metrology, Inspection, and Process Control for Microlithography XXX
KEYWORDS: Wafer-level optics, Etching, Metals, Scanners, Scanning electron microscopy, Double patterning technology, Semiconducting wafers, Optics manufacturing, Overlay metrology, Tin

PROCEEDINGS ARTICLE | April 8, 2016
Proc. SPIE. 9778, Metrology, Inspection, and Process Control for Microlithography XXX
KEYWORDS: Wafer-level optics, Optical lithography, Etching, Image segmentation, Scanners, Scanning electron microscopy, Semiconducting wafers, Overlay metrology, Tin, Back end of line

PROCEEDINGS ARTICLE | March 18, 2016
Proc. SPIE. 9778, Metrology, Inspection, and Process Control for Microlithography XXX
KEYWORDS: Signal to noise ratio, Metrology, Optical lithography, Etching, Image processing, Atomic force microscopy, Scanning electron microscopy, Transmission electron microscopy, 3D metrology, Process control, Line width roughness, Critical dimension metrology, Line edge roughness

Showing 5 of 20 publications
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