Paul J. Rudolph
Process Control Manager at Broadcom Inc
SPIE Involvement:
Author
Publications (5)

PROCEEDINGS ARTICLE | March 10, 2006
Proc. SPIE. 6155, Data Analysis and Modeling for Process Control III
KEYWORDS: Logic, Etching, Manufacturing, Inspection, Control systems, Scanning electron microscopy, Process control, Photomasks, Critical dimension metrology, Semiconducting wafers

PROCEEDINGS ARTICLE | May 17, 2005
Proc. SPIE. 5755, Data Analysis and Modeling for Process Control II
KEYWORDS: Signal to noise ratio, Statistical analysis, Detection and tracking algorithms, Sensors, Manufacturing, Inspection, Monte Carlo methods, Semiconductor manufacturing, Algorithm development, Semiconducting wafers

PROCEEDINGS ARTICLE | May 17, 2005
Proc. SPIE. 5755, Data Analysis and Modeling for Process Control II
KEYWORDS: Oxides, Statistical analysis, Data modeling, Etching, Error analysis, Process control, Plasma etching, Semiconducting wafers, Wafer testing, Plasma

PROCEEDINGS ARTICLE | May 17, 2005
Proc. SPIE. 5755, Data Analysis and Modeling for Process Control II
KEYWORDS: Calibration, Etching, Metals, Control systems, Scanning electron microscopy, Helium, Critical dimension metrology, Semiconducting wafers, Temperature metrology, Plasma

PROCEEDINGS ARTICLE | May 10, 2005
Proc. SPIE. 5752, Metrology, Inspection, and Process Control for Microlithography XIX
KEYWORDS: Oxides, Metrology, Logic, Scanning electron microscopy, Scatterometry, Reflectometry, Process control, Critical dimension metrology, Semiconducting wafers, Scatter measurement

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