Dr. Pei-Yang Yan
Principal Engineer at Intel Corp
SPIE Involvement:
Author
Publications (61)

PROCEEDINGS ARTICLE | March 16, 2015
Proc. SPIE. 9422, Extreme Ultraviolet (EUV) Lithography VI
KEYWORDS: Reflectivity, Surface roughness, Chromium, Atomic force microscopy, Image quality, Photomasks, Extreme ultraviolet, Line width roughness, Extreme ultraviolet lithography, Semiconducting wafers

PROCEEDINGS ARTICLE | September 9, 2013
Proc. SPIE. 8880, Photomask Technology 2013
KEYWORDS: Lithography, Metrology, Cadmium, Spectroscopy, Scanning electron microscopy, Scatterometry, Photomasks, Extreme ultraviolet, Critical dimension metrology, Line edge roughness

PROCEEDINGS ARTICLE | March 23, 2012
Proc. SPIE. 8322, Extreme Ultraviolet (EUV) Lithography III
KEYWORDS: Reflectivity, Image analysis, Printing, Photomasks, Extreme ultraviolet, Line width roughness, Extreme ultraviolet lithography, Semiconducting wafers, Binary data, Phase shifts

PROCEEDINGS ARTICLE | March 23, 2012
Proc. SPIE. 8322, Extreme Ultraviolet (EUV) Lithography III
KEYWORDS: Electron beam lithography, Silica, Inspection, Atomic force microscopy, Scanning electron microscopy, Precision measurement, Photomasks, Extreme ultraviolet lithography, Optical alignment, Defect inspection

PROCEEDINGS ARTICLE | March 23, 2012
Proc. SPIE. 8322, Extreme Ultraviolet (EUV) Lithography III
KEYWORDS: Reticles, Surface roughness, Chromium, Photomasks, Extreme ultraviolet, Extreme ultraviolet lithography, High volume manufacturing, Line edge roughness, Semiconducting wafers, Plasma

SPIE Journal Paper | July 1, 2011
JM3 Vol. 10 Issue 03
KEYWORDS: Extreme ultraviolet lithography, Photomasks, Extreme ultraviolet, Reflectivity, Tin, Binary data, Etching, Semiconducting wafers, Reflection, Signal attenuation

Showing 5 of 61 publications
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