Terahertz (THz) imaging has progressed tremendously due the continuous development of new THz emitters and detectors. However, highly integrated array devices are desired for fast THz imaging. Advanced features such as beam steering and phase contrast imaging may be realized using more complex systems that require tight integration. Silicon photonics is an enabler for CW THz applications such as imaging and high-speed communication because of low cost and high level of integration. We present results of our research on continuous-wave THz generation using antennacoupled silicon-germanium photodiodes. THz emission up to 2.2 THz has been demonstrated.
Within the European Project TERABOARD, a photonic integration platforms including electronic-photonic integration is developed to demonstrate high bandwidth high-density modules and to demonstrate cost and energy cost target objectives. Large count high bandwidth density EO interfaces for onboard and intra-data center interconnection are reported. For onboard large count interconnections a novel concept based on optical-TSV interconnection platform with no intersections and no WDM multiplexing is reported. All input/output coupler arrays based on a pluggable silica platform are reported as well.
Silicon photonics has become in the past years an important technology adopted by a growing number of
industrial players to develop their next generation optical transceivers. However most of the technology
platforms established in CMOS fabrication lines are kept captive or open to only a restricted number of
customers. In order to make silicon photonics accessible to a large number of players several initiatives exist
around the world to develop open platforms. In this paper we will present imec’s silicon photonics active
platform accessible through multi-project wafer runs.
System performance scaling imposes an increase of package-to-package aggregate bandwidths to interface chips in high performance computing. This scaling is expected to encounter several I/O bottlenecks (pin count, speed, power consumption) when implemented in the electrical domain. Several optical interface technologies are being proposed among which silicon photonics, considered as a promising candidate. In this paper we will review the recent progress made in this technology that may enable multi-channel WDM links for package-to-package interconnects: 1.0V drivers with microring modulators and compact manufacturable microring filters with efficient thermal tuning.
A Si photonics platform is described, co-integrating advanced passive components with Si modulators and Ge detectors.
This platform is developed on a 200mm CMOS toolset, compatible with a 130nm CMOS baseline. The paper describes
the process flow, and describes the performance of selected electro-optical devices to demonstrate the viability of the