Plasma immersion ion implantation (PIII) offers an alternative to ion beam with the advantage of high implantation rate.
However, problems inherent to the application of PIII to non-conducting materials such as polymers are due to surface
charging. To overcome these difficulties and to have a controllable implantation depth, we sputtered a thin layer of gold
before PIII is applied to the polymer substrate. The result is a controllable implantation dept and stronger adhesion
between the metal-polymer interfaces. The extent of implantation depth can be correlated to tribological properties,
electrical conductivity and Raman spectroscopy. While conductive AFM confirmed the conductivity of the embedded
layer, the future applications, difficulties and limitations using this technique for fabrication of conductive embedded
layer in polymers are also discussed.