Dr. Philippe Foubert
R&D Engineer at IMEC
SPIE Involvement:
Author
Publications (35)

PROCEEDINGS ARTICLE | March 27, 2018
Proc. SPIE. 10586, Advances in Patterning Materials and Processes XXXV
KEYWORDS: Calibration, Polymers, Ultraviolet radiation, Extreme ultraviolet, Image enhancement, Extreme ultraviolet lithography, Picosecond phenomena, Floods, Absorption, Chemically amplified resists

PROCEEDINGS ARTICLE | March 27, 2018
Proc. SPIE. 10583, Extreme Ultraviolet (EUV) Lithography IX
KEYWORDS: Optical lithography, Image processing, Ultraviolet radiation, Extreme ultraviolet, Absorbance, Extreme ultraviolet lithography, Picosecond phenomena, Line edge roughness, Absorption, Chemically amplified resists

PROCEEDINGS ARTICLE | March 19, 2018
Proc. SPIE. 10583, Extreme Ultraviolet (EUV) Lithography IX
KEYWORDS: Particles, Coating, Manufacturing, Extreme ultraviolet, Extreme ultraviolet lithography, Critical dimension metrology, Photoresist processing, Semiconducting wafers, Yield improvement, System on a chip

PROCEEDINGS ARTICLE | October 16, 2017
Proc. SPIE. 10451, Photomask Technology
KEYWORDS: Wafer-level optics, Oxides, Signal to noise ratio, Reticles, Inspection, Optical inspection, Wafer inspection, Photomasks, Extreme ultraviolet, Semiconducting wafers

PROCEEDINGS ARTICLE | October 16, 2017
Proc. SPIE. 10450, International Conference on Extreme Ultraviolet Lithography 2017
KEYWORDS: Scanners, Coating, Manufacturing, Extreme ultraviolet, Line width roughness, Extreme ultraviolet lithography, High volume manufacturing, Neodymium, Photoresist processing, Semiconducting wafers

PROCEEDINGS ARTICLE | April 7, 2017
Proc. SPIE. 10143, Extreme Ultraviolet (EUV) Lithography VIII
KEYWORDS: Optical lithography, Etching, Photoresist materials, Photomasks, Extreme ultraviolet, Extreme ultraviolet lithography, High volume manufacturing, Photoresist processing, Semiconducting wafers, Photoresist developing, Resolution enhancement technologies

Showing 5 of 35 publications
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