Dr. Phillip D. Hustad
Research Scientist at Dow Electronic Materials
SPIE Involvement:
Author
Publications (6)

PROCEEDINGS ARTICLE | March 27, 2015
Proc. SPIE. 9423, Alternative Lithographic Technologies VII
KEYWORDS: Optical lithography, Cadmium, Etching, Polymers, Glasses, Silicon, Scanning electron microscopy, Line width roughness, Directed self assembly, Reactive ion etching

PROCEEDINGS ARTICLE | March 19, 2015
Proc. SPIE. 9423, Alternative Lithographic Technologies VII
KEYWORDS: Cadmium, Etching, Dry etching, Polymers, Silicon, Scanning electron microscopy, Line width roughness, Directed self assembly, Line edge roughness, Semiconducting wafers

PROCEEDINGS ARTICLE | March 28, 2014
Proc. SPIE. 9054, Advanced Etch Technology for Nanopatterning III
KEYWORDS: Carbon, Optical lithography, Etching, Dry etching, Inspection, Scanning electron microscopy, Line width roughness, Directed self assembly, Cadmium sulfide, Semiconducting wafers

PROCEEDINGS ARTICLE | March 27, 2014
Proc. SPIE. 9051, Advances in Patterning Materials and Processes XXXI
KEYWORDS: Thin films, Optical lithography, Etching, Annealing, Interfaces, Diffusion, Coating, Scanning electron microscopy, Directed self assembly, Thin film coatings

PROCEEDINGS ARTICLE | March 26, 2013
Proc. SPIE. 8680, Alternative Lithographic Technologies V
KEYWORDS: Thin films, Optical lithography, Polymers, Annealing, Diffusion, Materials processing, Scanning electron microscopy, Directed self assembly, Reactive ion etching, Thin film coatings

PROCEEDINGS ARTICLE | March 21, 2012
Proc. SPIE. 8323, Alternative Lithographic Technologies IV
KEYWORDS: Thin films, Optical lithography, Etching, Annealing, Silicon, Materials processing, Scanning electron microscopy, Directed self assembly, Transistors, Reactive ion etching

Showing 5 of 6 publications
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