Dr. Pratul K. Ajmera Profile

Dr. Pratul K. Ajmera

Professor at Louisiana State Univ

SPIE Involvement:

Conference Program Committee | Conference Co-Chair | Author

Publications (23)

PROCEEDINGS ARTICLE | April 1, 2009

Low temperature deposition of carbon nanotubes

Proc. SPIE. 7291, Nanosensors, Biosensors, and Info-Tech Sensors and Systems 2009

KEYWORDS: Electron beams, Light sources, Nanoparticles, Annealing, Particles, Nickel, Scanning electron microscopy, Aluminum, Deposition processes, Carbon nanotubes

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PROCEEDINGS ARTICLE | March 26, 2008

A low-frequency vibration-to-electrical energy harvester

Proc. SPIE. 6931, Nanosensors and Microsensors for Bio-Systems 2008

KEYWORDS: Microelectromechanical systems, Sensors, Composites, Silicon, Magnetism, Energy harvesting, Bridges, Wind energy, Electromagnetism, Ferroelectric polymers

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PROCEEDINGS ARTICLE | March 31, 2006

Nickel electrodeposition studies for high-aspect-ratio microstructure fabrication for MEMS

Proc. SPIE. 6172, Smart Structures and Materials 2006: Smart Electronics, MEMS, BioMEMS, and Nanotechnology

KEYWORDS: Fabrication, Microelectromechanical systems, Electrodes, Nickel, Silicon, Hydrogen, Scanning electron microscopy, Photoresist materials, Plating, Electroplating

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SPIE Conference Volume | March 20, 2006

Smart Structures and Materials 2006: Smart Electronics, MEMS, BioMEMS, and Nanotechnology

PROCEEDINGS ARTICLE | May 16, 2005

Post-CMOS chip-level processing for high-aspect-ratio microprobe fabrication utilizing pulse plating

Proc. SPIE. 5763, Smart Structures and Materials 2005: Smart Electronics, MEMS, BioMEMS, and Nanotechnology

KEYWORDS: Etching, Metals, Nickel, Silicon, Photoresist materials, Signal processing, Plating, Semiconducting wafers, Signal detection, Electroplating

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PROCEEDINGS ARTICLE | May 16, 2005

Remote power delivery for hybrid integrated bio-implantable electrical stimulation system

Proc. SPIE. 5763, Smart Structures and Materials 2005: Smart Electronics, MEMS, BioMEMS, and Nanotechnology

KEYWORDS: Transmitters, Switches, Clocks, Capacitors, Electrodes, Resistance, Receivers, Transistors, Circuit switching, Inductance

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PROCEEDINGS ARTICLE | May 16, 2005

Charge pump CMOS circuit based on internal clock voltage boosting for biomedical applications

Proc. SPIE. 5763, Smart Structures and Materials 2005: Smart Electronics, MEMS, BioMEMS, and Nanotechnology

KEYWORDS: Microelectromechanical systems, Switches, Biomedical optics, Clocks, Capacitors, Power supplies, Diodes, Transistors, Photomicroscopy, Device simulation

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SPIE Conference Volume | May 16, 2005

Smart Structures and Materials 2005: Smart Electronics, MEMS, BioMEMS, and Nanotechnology

PROCEEDINGS ARTICLE | July 29, 2004

Differential laterally movable gate FETs (LMGFETs) as a position sensor

Proc. SPIE. 5389, Smart Structures and Materials 2004: Smart Electronics, MEMS, BioMEMS, and Nanotechnology

KEYWORDS: Microelectromechanical systems, Oxides, Sensors, Nickel, Photoresist materials, Boron, Field effect transistors, Position sensors, Semiconducting wafers, Electroplating

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PROCEEDINGS ARTICLE | July 29, 2004

0.8V ultralow-power CMOS analog multiplexer for remote biological and chemical signal processing

Proc. SPIE. 5389, Smart Structures and Materials 2004: Smart Electronics, MEMS, BioMEMS, and Nanotechnology

KEYWORDS: Switches, Sensors, Signal processing, Transistors, Field effect transistors, CMOS technology, Analog electronics, Multiplexers, Signal detection, Device simulation

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PROCEEDINGS ARTICLE | July 29, 2004

High-aspect-ratio neural probes for monolithic integration with ultra-low-power CMOS operational amplifier circuit

Proc. SPIE. 5389, Smart Structures and Materials 2004: Smart Electronics, MEMS, BioMEMS, and Nanotechnology

KEYWORDS: Electrodes, Metals, Copper, Nickel, Silicon, Amplifiers, Signal processing, Semiconducting wafers, Electroplating, Neurons

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PROCEEDINGS ARTICLE | July 22, 2003

Design, simulation, and fabrication of a novel integrated microaccelerometer utilizing a post-CMOS fabrication technique

Proc. SPIE. 5055, Smart Structures and Materials 2003: Smart Electronics, MEMS, BioMEMS, and Nanotechnology

KEYWORDS: Fabrication, Oxides, Sensors, Amplifiers, Signal processing, Transistors, Field effect transistors, Beam shaping, Molybdenum, Device simulation

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PROCEEDINGS ARTICLE | July 22, 2003

Ultralow-power operational amplifier CMOS chip for monolithic integration with neural microprobes

Proc. SPIE. 5055, Smart Structures and Materials 2003: Smart Electronics, MEMS, BioMEMS, and Nanotechnology

KEYWORDS: Mirrors, Electrodes, Nickel, Silicon, Amplifiers, Aluminum, Field effect transistors, Photomicroscopy, Electroplating, Neurons

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PROCEEDINGS ARTICLE | May 12, 2003

Noise analysis of an 0.8-V ultralow-power CMOS operational amplifier

Proc. SPIE. 5113, Noise in Devices and Circuits

KEYWORDS: Signal to noise ratio, Mirrors, Resistance, Amplifiers, Power supplies, Solids, Transistors, Field effect transistors, Device simulation, Standards development

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PROCEEDINGS ARTICLE | July 11, 2002

Novel scheme for a higher bandwidth sensor readout

Proc. SPIE. 4700, Smart Structures and Materials 2002: Smart Electronics, MEMS, and Nanotechnology

KEYWORDS: Logic, Switching, Capacitors, Sensors, Capacitance, Signal processing, Field effect transistors, Data conversion, Integrated circuit design, Binary data

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PROCEEDINGS ARTICLE | July 11, 2002

Laterally movable gate FET (LMGFET) as a resonant gate device

Proc. SPIE. 4700, Smart Structures and Materials 2002: Smart Electronics, MEMS, and Nanotechnology

KEYWORDS: Microelectromechanical systems, Oxides, Resonators, Nickel, Diffusion, Finite element methods, Field effect transistors, Structural design, Neodymium, Electroplating

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PROCEEDINGS ARTICLE | August 16, 2001

Laterally movable gate FET (LMGFET) for on-chip integration of MEMS with electronics

Proc. SPIE. 4334, Smart Structures and Materials 2001: Smart Electronics and MEMS

KEYWORDS: Microelectromechanical systems, Oxides, Electronics, Etching, Copper, Nickel, Photomasks, Field effect transistors, Plating, Prototyping

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PROCEEDINGS ARTICLE | June 21, 2000

New technique for direct integration of mechanical motion with electronics on a chip

Proc. SPIE. 3990, Smart Structures and Materials 2000: Smart Electronics and MEMS

KEYWORDS: Actuators, Oxides, Electronics, Etching, Electrodes, Capacitance, Photomasks, Transistors, Field effect transistors, Plating

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PROCEEDINGS ARTICLE | July 20, 1999

LIGA-like process for high-aspect-ratio PZT microstructures

Proc. SPIE. 3673, Smart Structures and Materials 1999: Smart Electronics and MEMS

KEYWORDS: Fabrication, Thin films, Ferroelectric materials, Polymethylmethacrylate, X-rays, Silicon, Image resolution, Medical imaging, Projection systems, Photoresist processing

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PROCEEDINGS ARTICLE | July 20, 1999

Digital-readout CMOS design for capacitive sensors using on-chip variable sense capacitor arrays

Proc. SPIE. 3673, Smart Structures and Materials 1999: Smart Electronics and MEMS

KEYWORDS: Microelectromechanical systems, CMOS sensors, Clocks, Capacitors, Sensors, Remote sensing, Amplifiers, Capacitance, CMOS technology, Analog electronics

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PROCEEDINGS ARTICLE | July 20, 1998

Development of a low-cost x-ray mask for high-aspect-ratio MEM smart structures

Proc. SPIE. 3328, Smart Structures and Materials 1998: Smart Electronics and MEMS

KEYWORDS: Microelectromechanical systems, Gold, Polymethylmethacrylate, Etching, Glasses, X-rays, Silicon, Photomasks, Plating, X-ray lithography

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PROCEEDINGS ARTICLE | July 20, 1998

Readout electronics scheme in CMOS technology for integration with analog outputs from integrated smart sensors

Proc. SPIE. 3328, Smart Structures and Materials 1998: Smart Electronics and MEMS

KEYWORDS: Microelectromechanical systems, CMOS sensors, Electronics, Sensors, Amplifiers, Signal processing, CMOS technology, Analog electronics, Digital electronics, Signal detection

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