Todays high reliability devices require photonic and optical components to be free from contaminants prior to final integratiuon into moduals. This is especially true for high power lasers, camera modules, etc. Often times multiple cleaning steps are needed on the part in order to remove debris left behind from it's carrier. Gel-Pak has studied various material and formfactor combinations that could possibly eliminate the need for these costly cleaning and inspection steps. This poster will present findings regarding a carrier that avoids contact with the active areas of optics and photonic devices.
There are numerous challenges associated with safely handling today’s photonic devices. These devices tend to be very sensitive to surface defects including scratching, foreign particles, and residue, all of which can be detrimental to their end-use performance. To address these concerns, industry requirements for handling optics and photonic devices are becoming more stringent with an increasing need for carriers that limit or avoid contact with the device active area. The limitations of traditional component handling technologies led Gel-Pak to investigate bio-based adhesion and to understand how its gripping action works. The presentation will discuss a body of work that has been published in this field studying how geckos, lizards, beetles, spiders, and ants can attach themselves to different surfaces but also detach themselves very easily without disturbing the surface. The research points to a unique micro-texture commonly found on the toe pads of such animals. Inspired by Gecko fibril microstructures, Gel-Pak has developed a series of textured carriers with reversible adhesion which limit the surface contact to less than 2% of the device surface area or entirely exclude any contact to the active device surface. These carriers are well suited for handling fragile optics and photonic devices. The presentation will discuss the specifics on this development effort and performance.