Dr. Rajeshuni Ramesham
at Jet Propulsion Lab
SPIE Involvement:
Fellow status | Symposium Committee | Conference Chair | Symposium Chair | Editor | Author
Publications (27)

PROCEEDINGS ARTICLE | March 7, 2014
Proc. SPIE. 8975, Reliability, Packaging, Testing, and Characterization of MOEMS/MEMS, Nanodevices, and Nanomaterials XIII
KEYWORDS: Packaging, Accelerated life testing, Capacitors, Reliability, Resistance, Electronic components, Niobium, Space operations, Cerium, Temperature metrology

PROCEEDINGS ARTICLE | March 9, 2013
Proc. SPIE. 8614, Reliability, Packaging, Testing, and Characterization of MOEMS/MEMS and Nanodevices XII
KEYWORDS: Packaging, Copper, Interfaces, Photography, Manufacturing, Reliability, Resistance, X-ray imaging, Electrical breakdown, Temperature metrology

SPIE Journal Paper | June 29, 2012
JM3 Vol. 11 Issue 02
KEYWORDS: Reliability, Packaging, Microopto electromechanical systems, Microelectromechanical systems, Nanostructures, Nanofabrication

Showing 5 of 27 publications
Conference Committee Involvement (22)
Reliability, Packaging, Testing, and Characterization of MOEMS/MEMS, Nanodevices, and Nanomaterials XIII
3 February 2014 | San Francisco, California, United States
SPIE MOEMS-MEMS
1 February 2014 | San Francisco, United States
Reliability, Packaging, Testing, and Characterization of MOEMS/MEMS and Nanodevices XII
4 February 2013 | San Francisco, California, United States
SPIE MOEMS-MEMS
2 February 2013 | San Francisco, United States
Reliability, Packaging, Testing, and Characterization of MEMS/MOEMS and Nanodevices XI
23 January 2012 | San Francisco, California, United States
Showing 5 of 22 published special sections
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