Randy A. Heyler
Site General Manager at Coherent Inc
SPIE Involvement:
Conference Chair | Conference Program Committee | Author | Instructor
Publications (10)

Proceedings Article | 10 June 2014
Proc. SPIE. 9073, Chemical, Biological, Radiological, Nuclear, and Explosives (CBRNE) Sensing XV
KEYWORDS: Optical filters, Statistical analysis, Signal attenuation, Spectroscopy, Molecules, Manufacturing, Raman spectroscopy, Chemical analysis, Explosives, Electronic filtering

Proceedings Article | 29 May 2013
Proc. SPIE. 8726, Next-Generation Spectroscopic Technologies VI
KEYWORDS: Optical filters, Spectroscopy, Forensic science, Linear filtering, Semiconductor lasers, Raman spectroscopy, Terahertz radiation, Chemical analysis, Explosives, Electronic filtering

Proceedings Article | 29 May 2013
Proc. SPIE. 8710, Chemical, Biological, Radiological, Nuclear, and Explosives (CBRNE) Sensing XIV
KEYWORDS: Optical filters, Spectroscopy, Linear filtering, Raman spectroscopy, Terahertz radiation, Chemical analysis, Explosives, Molecular spectroscopy, Electronic filtering, Terahertz spectroscopy

SPIE Conference Volume | 11 March 2005

SPIE Conference Volume | 10 June 2004

Showing 5 of 10 publications
Conference Committee Involvement (8)
Photonics Packaging and Integration VII
27 January 2005 | San Jose, California, United States
Photonics Packaging and Integration VI
29 January 2004 | San Jose, CA, United States
Emerging Optoelectronic Applications
26 January 2004 | San Jose, CA, United States
Photonics Packaging and Integration V
30 January 2003 | San Jose, CA, United States
Optoelectronic Interconnects, Integrated Circuits and Packaging
24 January 2002 | San Jose, California, United States
Showing 5 of 8 Conference Committees
Course Instructor
SC599: Photonics Packaging: Critical Component Assembly Processes
This course will focus on the key packaging optical assembly and test processes, covering critical process parameters, yield issues, manufacturing and test equipment, design guidelines and validation strategies, and cost models. Examples of different types of packages, including coaxial, butterfly, mini-DIL, and planar waveguide packages, will be used in case studies to compare various assembly methods and their costs. Test methods will be discussed with respect to their suitability for different stages of assembly.
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