Dr. Richard F. Carson
Director of Product Quality at TriLumina Corp
SPIE Involvement:
Conference Chair | Author | Editor
Publications (25)

PROCEEDINGS ARTICLE | February 19, 2018
Proc. SPIE. 10552, Vertical-Cavity Surface-Emitting Lasers XXII
KEYWORDS: Laser sources, LIDAR, Sensors, Gallium arsenide, Semiconductor lasers, Vertical cavity surface emitting lasers, High power diode lasers, Pulse generators, Direct detection LIDAR

PROCEEDINGS ARTICLE | February 25, 2017
Proc. SPIE. 10122, Vertical-Cavity Surface-Emitting Lasers XXI
KEYWORDS: Packaging, Gold, Modeling, Safety, LIDAR, Copper, Gallium arsenide, Feature extraction, Finite element methods, Aluminum nitride, Vertical cavity surface emitting lasers, Optimization (mathematics), Performance modeling, Thermal modeling, Fiber optic illuminators

PROCEEDINGS ARTICLE | February 25, 2017
Proc. SPIE. 10122, Vertical-Cavity Surface-Emitting Lasers XXI
KEYWORDS: Antireflective coatings, Quantum wells, Lithium, Modulation, Metals, Gallium arsenide, Resistance, Distributed Bragg reflectors, Vertical cavity surface emitting lasers, Semiconducting wafers

PROCEEDINGS ARTICLE | March 18, 2016
Proc. SPIE. 9766, Vertical-Cavity Surface-Emitting Lasers XX
KEYWORDS: Near infrared, Cameras, LIDAR, Sensors, Metals, Laser applications, Semiconductor lasers, Vertical cavity surface emitting lasers, Pulsed laser operation, Fiber optic illuminators

PROCEEDINGS ARTICLE | March 20, 2015
Proc. SPIE. 9381, Vertical-Cavity Surface-Emitting Lasers XIX
KEYWORDS: Near infrared, Modulation, Imaging systems, LIDAR, Metals, Semiconductor lasers, Vertical cavity surface emitting lasers, Pulsed laser operation, Inductance, Temperature metrology

PROCEEDINGS ARTICLE | September 17, 2014
Proc. SPIE. 9226, Nanophotonics and Macrophotonics for Space Environments VIII
KEYWORDS: Eye, Modulation, Receivers, Free space, Telecommunications, Collimation, Free space optics, Vertical cavity surface emitting lasers, Data communications, Free space optical communications

Showing 5 of 25 publications
Conference Committee Involvement (1)
Optoelectronic Materials, Devices, Packaging, and Interconnects
17 August 1986 | Cambridge, MA, United States
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