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Richard Ong
at Infineon Technologies Austria Ag
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Publications (1)
Proceedings Article | 24 April 2020 Paper
Stress analysis of Si chip sidewalls using micro-Raman spectroscopy
M. De Biasio, M. Kraft, R. Ong, C. Seifert, M. Ossiander, B. Bernard, M. Roesner
Proceedings Volume 11390, 1139015 (2020) https://doi.org/10.1117/12.2557033
KEYWORDS: Raman spectroscopy, Silicon, Laser processing, Stress analysis, Micro raman spectroscopy, Semiconductor lasers, Microscopes, Calibration, Semiconducting wafers
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