CONFERENCE PROCEEDINGS
Advanced Search
Richard F. Toftness
Consultant
SPIE Involvement:
Author
Publications (1)
Proceedings Article | 12 April 2005 Paper
Laser technology for wafer dicing and microvia drilling for next generation wafers
Proceedings Volume 5713, (2005) https://doi.org/10.1117/12.602033
KEYWORDS: Semiconducting wafers, Laser drilling, Laser processing, Dysprosium, Laser applications, Wafer dicing, Silicon, Laser development, Copper, Ultraviolet radiation
Conference Committee Involvement (1)
Laser Applications in Microelectronic and Optoelectronic Manufacturing XI
23 January 2006 | San Jose, California, United States
SIGN IN TO:
  • View contact details
UPDATE YOUR PROFILE
Is this your profile? Update it now.
Sign into your SPIE.org account
Don’t have a profile and want one?
Create an account on SPIE.org
Advertisement
Advertisement
Back to Top