A solution to the problems of roll-to-roll lithography on flexible substrates is presented. We have developed a roll-toroll
imprint lithography technique to fabricate active matrix transistor backplanes on flexible webs of polyimide that
have a blanket material stack of metals, dielectrics, and semiconductors. Imprint lithography produces a multi-level 3-
dimensional mask that is then successively etched to pattern the underlying layers into the desired structures. This
process, Self-Aligned Imprint Lithography (SAIL), solves the
layer-to-layer alignment problem because all masking levels are created with one imprint step. The processes and equipment required for complete roll-to-roll SAIL fabrication will be described. Emphasis will be placed on the advances in the roll-to-roll imprint process which have enabled us to produce working transistor arrays.