This paper describes the design and performance of a new high-resolution 35 mm format CCD image sensor using an
advanced 5.5 μm interline pixel. The pixels are arranged in a 6576 (H) × 4384 (V) format to support a 3:2 aspect ratio.
This device is part of a family of devices that share a common architecture, pixel performance, and packaging
arrangement. Unique to this device in the family is the implementation of a fast line dump structure and horizontal CCD
lateral overflow drain.