Dr. Roberto Fallica
at imec
SPIE Involvement:
Area of Expertise:
lithography , EUV , nanotechnology , patterning , underlayer , photoresist
Profile Summary

Roberto Fallica received his master's degree in Electronics Engineering from Politecnico di Milano (Italy) in 2007 and completed the PhD school in Nanotechnology from University of Milano-Bicocca in 2012 with a thesis on the characterization of phase-change chalcogenide nanowires for nonvolatile data storage. In 2014 he was postdoc researcher at the Paul Scherrer Institute (Switzerland) working at the dedicated EUV/X-ray interference lithography and X-ray absorption spectroscopy beamline for characterization and patterning of nanoscale photoresist structures. Since 2018, he is staff researcher in the Advanced Patterning department of IMEC (Belgium). His duties include the screening of lithography materials and stacks to develop the technology that will enable future semiconductor devices in BEOL (back-end of line) such as DRAM (storage layer) and logic (metalization). For this purpose he is focusing on characterization of EUV litho stack materials (photoresist and underlayers) especially for defect mitigation by improving adhesion. In addition, he is in charge of measuring fundamental physical properties of EUV photoresists such as electron blur and electronic processes by photoemission spectroscopy and photocurrent. He is member of SPIE since 2016.
Publications (22)

Proceedings Article | 10 April 2024 Presentation + Paper
Atul Tiwari, Roberto Fallica, Marcelo Ackermann, Igor Makhotkin
Proceedings Volume 12955, 1295505 (2024) https://doi.org/10.1117/12.3010917
KEYWORDS: Photoacid generators, X-rays, Photoresist materials, Standing waves, Extreme ultraviolet lithography, Film thickness, Reflectivity, Fluorescence

Proceedings Article | 9 April 2024 Presentation + Paper
Proceedings Volume 12957, 1295712 (2024) https://doi.org/10.1117/12.3009801
KEYWORDS: Extreme ultraviolet lithography, Photoresist materials, Adhesion, Etching, Semiconducting wafers, Extreme ultraviolet, Silicon, Line width roughness, Chemically amplified resists, Amorphous carbon

Proceedings Article | 21 November 2023 Presentation + Paper
Proceedings Volume 12750, 127500I (2023) https://doi.org/10.1117/12.2687546
KEYWORDS: Factor analysis, Extreme ultraviolet lithography, Surface roughness, Photoresist materials, Statistical analysis, Line width roughness, Extreme ultraviolet, Metal oxides, Lithography

Proceedings Article | 1 May 2023 Presentation + Paper
Proceedings Volume 12498, 124980R (2023) https://doi.org/10.1117/12.2660376
KEYWORDS: Film thickness, Extreme ultraviolet lithography, Etching, Adhesion, Line width roughness, Line edge roughness, Surface roughness, Lithography, Interfaces

Proceedings Article | 1 May 2023 Presentation + Paper
Roberto Fallica, Nicola Mahne, Thierry Conard, Anja Vanleenhove, Stefano Nannarone
Proceedings Volume 12498, 124980J (2023) https://doi.org/10.1117/12.2658310
KEYWORDS: Electrons, Photoresist materials, Extreme ultraviolet lithography, Photoacid generators, Polymers, Quenching, Copolymers, Optical lithography, Lithography, Extreme ultraviolet

Showing 5 of 22 publications
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