Romain J. Lallement
at IBM
SPIE Involvement:
Conference Program Committee | Author
Profile Summary

Romain Lallement is currently Mask and Patterning Technical Project Leader at IBM’s AI Hardware Center where he leads mask technology development and introduces them into IBM’s test site pipeline. This central role in IBM’s Nanotechnology Laboratory relies on a holistic understanding of advanced photolithography, mask processes, and technology node requirements to support IBM’s roadmap. Recently, Romain achieved extreme ultraviolet (EUV) mask process qualification to enable single exposure yield at 30nm pitch, as well as seamless mask technology introduction for IBM International Semiconductor Development Alliance (ISDA) into leading edge Gate All Around (GAA) technology.
Prior to serving as Mask and Patterning Technical Project Leader, Romain held several team lead positions within ISDA. Working alongside partners from every aspect of the industry, he has managed projects of highly skilled multidisciplinary engineers in photo lithography, reactive ion etching, wet etching and device, contributing to Design Technology Co Optimization (DTCO) across the device Front End of the Line (FEOL), and as well as leading the patterning team test site install. In this role Romain developed key aspect of the spacer, work function metal module, leading to the success of the NanoSheet device architecture for 5 nm and beyond.
Romain holds a master’s degree in Material Science from Polytech Marseille, France. After graduating, Romain joined STMicroelectronics where he worked in R&D as photo lithography engineer on Complementary metal–oxide–semiconductor (CMOS) and embedded nonvolatile memory (eNVM) technology. He has qualified technologies to the highest standards of quality for the most stringent applications in automotive and bio-medical technology. He also successfully managed the transition of an entire manufacturing site to a new APC system significantly improving fab metrics. Romain has co-authored several published articles and holds 7 patents in the US and internationally
Publications (14)

Proceedings Article | 21 November 2023 Presentation + Paper
Proceedings Volume 12751, 127510M (2023)
KEYWORDS: SRAF, Extreme ultraviolet, Optical lithography, Resolution enhancement technologies, Opacity, Extreme ultraviolet lithography, Optical proximity correction, Line edge roughness, Semiconducting wafers, Printing

Proceedings Article | 28 April 2023 Presentation + Paper
Proceedings Volume 12494, 124940S (2023)
KEYWORDS: Monte Carlo methods, Extreme ultraviolet lithography, Scanners, Deep ultraviolet, Design and modelling, Semiconducting wafers, Overlay metrology, Photomasks, Extreme ultraviolet, Error analysis

Proceedings Article | 13 June 2022 Presentation
Romain Lallement, Jaime Morillo, Daniel Schmidt, Rick Johnson, Cody Murray, Martin Burkhardt, Allen Gabor
Proceedings Volume PC12051, PC120510R (2022)
KEYWORDS: Monte Carlo methods, Scanners, Extreme ultraviolet lithography, Overlay metrology, Semiconducting wafers, Photomasks, Optical lithography, Manufacturing, Lithography, Extreme ultraviolet

Proceedings Article | 13 June 2022 Presentation
Proceedings Volume PC12053, PC120530C (2022)
KEYWORDS: Critical dimension metrology, Metrology, Scanning electron microscopy, Photoresist materials, Optical proximity correction, Process modeling, Data modeling, Photomasks, Lithography, Extreme ultraviolet lithography

Proceedings Article | 26 May 2022 Presentation + Paper
Proceedings Volume 12051, 120510C (2022)
KEYWORDS: Nickel, Photomasks, Extreme ultraviolet, SRAF, Phase shifts, Absorption, Diffraction, Optical lithography, Tantalum

Showing 5 of 14 publications
Conference Committee Involvement (4)
Photomask Technology 2024
29 September 2024 | Monterey, California, United States
Photomask Technology 2023
2 October 2023 | Monterey, California, United States
Photomask Technology 2022
26 September 2022 | Monterey, California, United States
Photomask Technology
27 September 2021 | Online Only, United States
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