Dr. Roman Chalyck
at SAMSUNG Electronics Co Ltd
SPIE Involvement:
Author
Publications (12)

PROCEEDINGS ARTICLE | March 24, 2017
Proc. SPIE. 10143, Extreme Ultraviolet (EUV) Lithography VIII
KEYWORDS: Reticles, Logic, Scanners, Manufacturing, Pellicles, Transmittance, Photomasks, Extreme ultraviolet, Extreme ultraviolet lithography, Chemical elements

PROCEEDINGS ARTICLE | March 18, 2016
Proc. SPIE. 9776, Extreme Ultraviolet (EUV) Lithography VII
KEYWORDS: Thermography, Thin films, Lithography, Graphene, Crystals, Silicon, Hydrogen, Infrared lasers, Pellicles, Silicon films, Transmittance, Extreme ultraviolet, Extreme ultraviolet lithography

PROCEEDINGS ARTICLE | April 1, 2013
Proc. SPIE. 8679, Extreme Ultraviolet (EUV) Lithography IV
KEYWORDS: Wafer-level optics, Cadmium, Ions, Reflectivity, Photomasks, Extreme ultraviolet, Extreme ultraviolet lithography, Neodymium, Semiconducting wafers

PROCEEDINGS ARTICLE | March 7, 2008
Proc. SPIE. 6924, Optical Microlithography XXI
KEYWORDS: Diffraction, Refractive index, Femtosecond phenomena, Quartz, Distortion, Transmittance, Photomasks, Semiconducting wafers, Pulsed laser operation, Binary data

PROCEEDINGS ARTICLE | May 12, 2007
Proc. SPIE. 6607, Photomask and Next-Generation Lithography Mask Technology XIV
KEYWORDS: Diffraction, Metrology, Polarization, Scatterometry, 3D metrology, Photomasks, Extreme ultraviolet, Shape analysis, Extreme ultraviolet lithography, Scatter measurement

PROCEEDINGS ARTICLE | April 5, 2007
Proc. SPIE. 6518, Metrology, Inspection, and Process Control for Microlithography XXI
KEYWORDS: Diffraction, Finite-difference time-domain method, Cadmium, Polarization, Scatterometry, Precision measurement, Process control, Photomasks, Critical dimension metrology, Scatter measurement

Showing 5 of 12 publications
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